Molex Mega-Fit Series Right Angle Through Hole PCB Header, 4 Contact(s), 5.7 mm Pitch, 1 Row, Shrouded
- RS 제품 번호:
- 200-5641
- Distrelec 제품 번호:
- 304-32-088
- 제조사 부품 번호:
- 200241-4214
- 제조업체:
- Molex
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Subtotal (1 pack of 5 units)*
₩15,886.00
재고있음
- 추가로 2026년 1월 12일 부터 95 개 단위 배송
더 자세한 내용이 필요하신가요? 필요한 수량을 입력하고 '배송일 확인'을 클릭하면 더 많은 재고 및 배송 세부정보를 확인하실 수 있습니다.
수량 | 한팩당 | 한팩당* |
|---|---|---|
| 5 - 15 | ₩3,177.20 | ₩15,886.00 |
| 20 - 30 | ₩3,109.52 | ₩15,547.60 |
| 35 + | ₩3,041.84 | ₩15,209.20 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 200-5641
- Distrelec 제품 번호:
- 304-32-088
- 제조사 부품 번호:
- 200241-4214
- 제조업체:
- Molex
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제품 세부 사항
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Molex | |
| Product Type | PCB Header | |
| Series | Mega-Fit | |
| Current | 23.5A | |
| Pitch | 5.7mm | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Contacts | 4 | |
| Number of Rows | 1 | |
| Orientation | Right Angle | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Wire-to-Board | |
| Mount Type | Through Hole | |
| Contact Plating | Tin | |
| Contact Material | Copper Alloy | |
| Termination Type | Solder | |
| Minimum Operating Temperature | -40°C | |
| Row Pitch | 5.7mm | |
| Maximum Operating Temperature | 105°C | |
| Tail Pin Length | 3.6mm | |
| Contact Gender | Male | |
| Standards/Approvals | No | |
| Voltage | 600 V | |
| 모두 선택 | ||
|---|---|---|
브랜드 Molex | ||
Product Type PCB Header | ||
Series Mega-Fit | ||
Current 23.5A | ||
Pitch 5.7mm | ||
Housing Material Liquid Crystal Polymer | ||
Number of Contacts 4 | ||
Number of Rows 1 | ||
Orientation Right Angle | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Wire-to-Board | ||
Mount Type Through Hole | ||
Contact Plating Tin | ||
Contact Material Copper Alloy | ||
Termination Type Solder | ||
Minimum Operating Temperature -40°C | ||
Row Pitch 5.7mm | ||
Maximum Operating Temperature 105°C | ||
Tail Pin Length 3.6mm | ||
Contact Gender Male | ||
Standards/Approvals No | ||
Voltage 600 V | ||
- COO (Country of Origin):
- CN
Molex 200241 Series PCB Header, 5.7mm Pitch, 4 Contacts - 200241-4214
This PCB header is a right-angle connector specifically designed for power applications in a compact format. With a 5.7mm pitch, it is equipped with four circuits and features unshrouded terminals. Constructed from highly conductive copper alloy and plated with matte tin, this through hole connector ensures effective wire-to-board connections. It operates effectively within a voltage range of up to 600V, making it suitable for demanding electrical environments.
Features & Benefits
• High current rating of 26A ensures robust power delivery
• Unshrouded design simplifies connectivity in tight spaces
• Durable matte tin contact plating enhances conductivity
• Highly conductive copper alloy offers reliable performance
• Right-angle orientation aids in PCB layout flexibility
• Operating temperature range from -40° to +105°C supports diverse applications
Applications
• Ideal for high-power electrical devices within automation systems
• Suitable for connecting electronic components in mechanical equipment
• Used in power distribution modules for efficient energy management
• Effective in requiring reliable wire-to-board connections
What are the considerations for using this connector in high-current applications?
This connector is rated for a maximum of 26A, making it ideal for delivering high currents safely. Ensure that the PCB design accommodates the appropriate thermal management to handle heat dissipation efficiently.
How does the unshrouded design benefit the installation process?
The unshrouded design allows for easier access to the contacts, facilitating straightforward plug-in connections, particularly beneficial in densely populated PCB layouts.
What are the recommended PCB thicknesses for optimal usage?
Optimal PCB thicknesses for this header range between 1.58mm and 2.36mm, ensuring a secure fit and reliable electrical contact.
How does matte tin plating contribute to the connectors performance?
The matte tin contact plating reduces the risk of oxidation, ensuring consistent conductivity and enhancing the longevity of the connection within various operational environments.
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