Molex SlimStack Series Straight, Vertical Surface PCB Header, 20 Contact(s), 0.5 mm Pitch, 2 Row, Shrouded

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Subtotal (1 reel of 750 units)*

₩1,845,675.00

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750 - 3000₩2,460.90₩1,845,967.50
3750 - 6750₩2,412.15₩1,809,112.50
7500 +₩2,363.40₩1,772,842.50

* 참고 가격: 실제 구매가격과 다를 수 있습니다

RS 제품 번호:
179-6631
제조사 부품 번호:
53748-0208-TR750
제조업체:
Molex
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브랜드

Molex

Series

SlimStack

Product Type

PCB Header

Current

500mA

Pitch

0.5mm

Number of Contacts

20

Number of Rows

2

Orientation

Straight, Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Surface

Connector System

Board-to-Board, Board-to-Board

Contact Material

Brass, Brass

Contact Plating

Gold, Gold

Minimum Operating Temperature

-40°C

Termination Type

Solder

Row Pitch

0.5mm

Maximum Operating Temperature

105°C

Contact Gender

Male

Standards/Approvals

No

Voltage

50V

COO (Country of Origin):
JP

Molex 53748 Series PCB Header, 20 Contacts, 0.5mm Pitch - 53748-0208-TR750


This PCB header is a part of the SlimStack™ series, specifically designed for board-to-board applications. Featuring a compact 0.5mm pitch, this surface mount connector is configured in a dual-row format with 20 circuits. With a vertical body orientation and a stack height of 3.00mm, it is engineered for integration in various electronic devices.

Features & Benefits


• Suitable for surface mounting, simplifying assembly processes

• Shrouded design prevents misalignment during connection

• Dual-row layout optimises space utilisation on PCB

• Solder termination method ensures robust and reliable connections

• Gold plating enhances electrical conductivity and corrosion resistance

• Operating temperature range of -40°C to +105°C accommodates various environments

Applications


• Utilised for communication devices to create secure connections

• Implemented in consumer electronics for efficient signal transfer

• Employed in automation systems to ensure reliable board-to-board connectivity

• Integrated into medical equipment for dependable performance

• Commonly used in automotive for robust circuitry

How do the gold plating and brass materials enhance performance?


The gold plating delivers superior conductivity, whilst the brass offers excellent mechanical strength, reducing the risk of connection failure during operation.

What are the considerations for using this connector in high-temperature environments?


The connector is designed to operate within a broad temperature range, ensuring reliable performance even in challenging conditions, thereby maintaining signal integrity.

How does the shrouded design contribute to the ease of use?


The shrouded design helps prevent misalignment during mating, making connections straightforward and facilitating quicker assembly processes, especially in high-volume manufacturing.

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