Molex 70555 Series Right Angle Through Hole Header, 5 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded
- RS 제품 번호:
- 816-983
- 제조사 부품 번호:
- 70555-0039
- 제조업체:
- Molex
N
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이 품목의 재입고 여부는 알 수 없으며 제조업체에서 단종되고 있습니다.
- RS 제품 번호:
- 816-983
- 제조사 부품 번호:
- 70555-0039
- 제조업체:
- Molex
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참조 문서
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제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Molex | |
| Product Type | Header | |
| Series | 70555 | |
| Pitch | 2.54mm | |
| Current | 3A | |
| Number of Contacts | 5 | |
| Housing Material | High Temperature Thermoplastic | |
| Number of Rows | 1 | |
| Orientation | Right Angle | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Connector System | Wire-to-Board | |
| Contact Material | Brass, Phosphor Bronze | |
| Contact Plating | Gold | |
| Termination Type | Through Hole | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 105°C | |
| Contact Gender | Male | |
| Standards/Approvals | RoHS | |
| Voltage | 250V | |
| 모두 선택 | ||
|---|---|---|
브랜드 Molex | ||
Product Type Header | ||
Series 70555 | ||
Pitch 2.54mm | ||
Current 3A | ||
Number of Contacts 5 | ||
Housing Material High Temperature Thermoplastic | ||
Number of Rows 1 | ||
Orientation Right Angle | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Connector System Wire-to-Board | ||
Contact Material Brass, Phosphor Bronze | ||
Contact Plating Gold | ||
Termination Type Through Hole | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 105°C | ||
Contact Gender Male | ||
Standards/Approvals RoHS | ||
Voltage 250V | ||
- COO (Country of Origin):
- MY
The Molex SL Header is a compact, single-row connector is designed for efficient wire-to-board applications, featuring a right-angle configuration and a durable, shrouded design for enhanced stability and protection against misalignment.
5 circuits ensure reliable signal connections
Suitable for a temperature range of -40° to +105°C
Constructed from high-temperature thermoplastic for durability
Gold selective plating minimises oxidation and enhances conductivity
Features through-hole solder termination for secure attachment
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