Molex 505417 Series Vertical Through Hole PCB Header, 34 Contact(s), 0.35 mm Pitch, 2 Row, Shrouded
- RS 제품 번호:
- 796-469
- 제조사 부품 번호:
- 505417-3410
- 제조업체:
- Molex
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Subtotal (1 reel of 7000 units)*
₩12,167,450.10
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- 2026년 10월 22일 부터 배송
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릴당 | 릴당 | 한팩당* |
|---|---|---|
| 1 + | ₩12,167,450.10 | ₩1,737.45 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 796-469
- 제조사 부품 번호:
- 505417-3410
- 제조업체:
- Molex
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Molex | |
| Series | 505417 | |
| Product Type | PCB Header | |
| Current | 3A | |
| Pitch | 0.35mm | |
| Number of Contacts | 34 | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Rows | 2 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Connector System | Board-to-Board | |
| Contact Plating | Gold | |
| Contact Material | Copper Alloy | |
| Minimum Operating Temperature | -40°C | |
| Row Pitch | 0.35mm | |
| Termination Type | Surface Mount | |
| Maximum Operating Temperature | 85°C | |
| Contact Gender | Male | |
| Standards/Approvals | UL | |
| Voltage | 50V | |
| 모두 선택 | ||
|---|---|---|
브랜드 Molex | ||
Series 505417 | ||
Product Type PCB Header | ||
Current 3A | ||
Pitch 0.35mm | ||
Number of Contacts 34 | ||
Housing Material Liquid Crystal Polymer | ||
Number of Rows 2 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Connector System Board-to-Board | ||
Contact Plating Gold | ||
Contact Material Copper Alloy | ||
Minimum Operating Temperature -40°C | ||
Row Pitch 0.35mm | ||
Termination Type Surface Mount | ||
Maximum Operating Temperature 85°C | ||
Contact Gender Male | ||
Standards/Approvals UL | ||
Voltage 50V | ||
- COO (Country of Origin):
- JP
The Molex Board-to-Board Plug provides a high-density connection for Compact electronic assemblies. This 34 circuit component supports a 1.00mm mated height and 2.00mm mated width to maximise space on precision PCBs.
Armor Nail feature for enhanced mechanical strength
Ultra-fine 0.35mm pitch for dense layouts
Slim profile for portable device integration
Durable construction for reliable signal mating
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