Molex 52885 Series Vertical Surface PCB, 160 Contact(s), 2 mm Pitch, 2 Row, Unshrouded
- RS 제품 번호:
- 796-372
- 제조사 부품 번호:
- 52885-1674
- 제조업체:
- Molex
N
Subtotal (1 reel of 1000 units)*
₩9,965,730.45
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- 2026년 12월 21일 부터 배송
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릴당 | 릴당 | 한팩당* |
|---|---|---|
| 1 + | ₩9,965,730.45 | ₩9,966.45 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 796-372
- 제조사 부품 번호:
- 52885-1674
- 제조업체:
- Molex
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참조 문서
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제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Molex | |
| Series | 52885 | |
| Product Type | PCB | |
| Current | 0.5A | |
| Pitch | 2mm | |
| Housing Material | High Temperature Thermoplastic | |
| Number of Contacts | 160 | |
| Number of Rows | 2 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Unshrouded | |
| Connector System | Board-to-Board | |
| Mount Type | Surface | |
| Contact Plating | Gold, Tin | |
| Contact Material | Copper Alloy | |
| Termination Type | Surface Mount | |
| Minimum Operating Temperature | -55°C | |
| Contact Gender | Female | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | RoHS | |
| Voltage | 100V | |
| 모두 선택 | ||
|---|---|---|
브랜드 Molex | ||
Series 52885 | ||
Product Type PCB | ||
Current 0.5A | ||
Pitch 2mm | ||
Housing Material High Temperature Thermoplastic | ||
Number of Contacts 160 | ||
Number of Rows 2 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Unshrouded | ||
Connector System Board-to-Board | ||
Mount Type Surface | ||
Contact Plating Gold, Tin | ||
Contact Material Copper Alloy | ||
Termination Type Surface Mount | ||
Minimum Operating Temperature -55°C | ||
Contact Gender Female | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals RoHS | ||
Voltage 100V | ||
- COO (Country of Origin):
- JP
The Molex Connector is a slimstack board-to-board connection solution designed for efficient signal transmission, featuring a Compact 0.635mm pitch. It supports a wide mated height range to accommodate diverse application requirements.
Supports a mated height range of 6.00 to 10.00mm for design versatility
Features 160 circuits for high connectivity in a Compact form factor
Constructed from a high-temperature thermoplastic for durability
Utilises gold and tin plating to enhance connection reliability
Offers a temperature range of -55° to +105°C for various environmental conditions
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