Molex 43045 Series Straight Surface PCB Header, 2 Contact(s), 3.00 mm Pitch, 2 Row, Shrouded
- RS 제품 번호:
- 795-333
- 제조사 부품 번호:
- 43045-0215
- 제조업체:
- Molex
N
Subtotal (1 reel of 200 units)*
₩525,306.60
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- 2026년 10월 12일 부터 배송
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릴당 | 릴당 | 한팩당* |
|---|---|---|
| 1 + | ₩525,306.60 | ₩2,626.65 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 795-333
- 제조사 부품 번호:
- 43045-0215
- 제조업체:
- Molex
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참조 문서
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Molex | |
| Product Type | PCB Header | |
| Series | 43045 | |
| Current | 8.5A | |
| Pitch | 3.00mm | |
| Number of Contacts | 2 | |
| Housing Material | High Temperature Thermoplastic | |
| Number of Rows | 2 | |
| Orientation | Straight | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Surface | |
| Contact Plating | Tin | |
| Contact Material | Brass | |
| Termination Type | Surface Mount | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | UL | |
| Voltage | 600V | |
| 모두 선택 | ||
|---|---|---|
브랜드 Molex | ||
Product Type PCB Header | ||
Series 43045 | ||
Current 8.5A | ||
Pitch 3.00mm | ||
Number of Contacts 2 | ||
Housing Material High Temperature Thermoplastic | ||
Number of Rows 2 | ||
Orientation Straight | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Surface | ||
Contact Plating Tin | ||
Contact Material Brass | ||
Termination Type Surface Mount | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals UL | ||
Voltage 600V | ||
- COO (Country of Origin):
- CN
The Molex vertical header facilitates reliable power and connectivity in Compact applications, featuring a dual-row design with two circuits and a 3.00mm pitch for efficient space utilisation.
Current rating of 8.5A per contact ensuring robust performance
Glow-wire capable, compliant with IEC standards for enhanced safety
Constructed with high-temperature thermoplastic for durability under extreme conditions
Designed for surface mount termination, maximising board space efficiency
Vertical orientation provides a Compact footprint for application flexibility
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