Molex 172064 Series Straight Through Hole PCB Header, 6 Contact(s), 5.2 mm Pitch, 1 Row, Shrouded
- RS 제품 번호:
- 788-324
- 제조사 부품 번호:
- 172065-0006
- 제조업체:
- Molex
N
Subtotal (1 Bag of 50 units)*
₩591,916.65
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- 2026년 10월 15일 부터 배송
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Bag(s) | Per Bag | 한팩당* |
|---|---|---|
| 1 + | ₩591,916.65 | ₩11,838.45 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 788-324
- 제조사 부품 번호:
- 172065-0006
- 제조업체:
- Molex
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참조 문서
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제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Molex | |
| Product Type | PCB Header | |
| Series | 172064 | |
| Pitch | 5.2mm | |
| Current | 23A | |
| Number of Contacts | 6 | |
| Housing Material | Polymer | |
| Number of Rows | 1 | |
| Orientation | Straight | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Connector System | Wire-to-Board | |
| Contact Material | Brass | |
| Contact Plating | Gold | |
| Minimum Operating Temperature | -40°C | |
| Termination Type | Through Hole | |
| Maximum Operating Temperature | 105°C | |
| Contact Gender | Female | |
| Standards/Approvals | UL | |
| Voltage | 600V | |
| 모두 선택 | ||
|---|---|---|
브랜드 Molex | ||
Product Type PCB Header | ||
Series 172064 | ||
Pitch 5.2mm | ||
Current 23A | ||
Number of Contacts 6 | ||
Housing Material Polymer | ||
Number of Rows 1 | ||
Orientation Straight | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Connector System Wire-to-Board | ||
Contact Material Brass | ||
Contact Plating Gold | ||
Minimum Operating Temperature -40°C | ||
Termination Type Through Hole | ||
Maximum Operating Temperature 105°C | ||
Contact Gender Female | ||
Standards/Approvals UL | ||
Voltage 600V | ||
- COO (Country of Origin):
- CN
The Molex PCB header is a versatile interconnect solution designed for reliable board-to-board connections in various applications, ensuring seamless data and power transfer for electronic devices.
Offers high-speed data transmission capabilities
Designed for robust performance in Compact spaces
Features multiple connector variations to suit different needs
Provides exceptional reliability and longevity in electronic assemblies
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