Molex 172064 Series Right Angle Through Hole PCB Header Pin, 12 Contact(s), 5.7 mm Pitch, 2 Row, Shrouded
- RS 제품 번호:
- 683-579
- 제조사 부품 번호:
- 172064-0012
- 제조업체:
- Molex
Subtotal (1 tray of 20 units)*
₩537,476.55
제조사가 재고 비축중
- 2026년 10월 12일 부터 배송 준비 완료
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Tray(s) | Per Tray | 한팩당* |
|---|---|---|
| 1 + | ₩537,476.55 | ₩26,874.90 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 683-579
- 제조사 부품 번호:
- 172064-0012
- 제조업체:
- Molex
사양
참조 문서
제정법과 컴플라이언스
제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Molex | |
| Product Type | PCB Header Pin | |
| Series | 172064 | |
| Pitch | 5.7mm | |
| Number of Contacts | 12 | |
| Number of Rows | 2 | |
| Orientation | Right Angle | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Row Pitch | 5.7mm | |
| Standards/Approvals | RoHS | |
| 모두 선택 | ||
|---|---|---|
브랜드 Molex | ||
Product Type PCB Header Pin | ||
Series 172064 | ||
Pitch 5.7mm | ||
Number of Contacts 12 | ||
Number of Rows 2 | ||
Orientation Right Angle | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Row Pitch 5.7mm | ||
Standards/Approvals RoHS | ||
- COO (Country of Origin):
- CN
The Molex Mega-Fit right-angle header is expertly designed for efficient power and wire-to-board applications. This component features 12 circuits, ensuring optimal connectivity and reliable performance. Built with a 5.70mm pitch, it accommodates a variety of PCB thicknesses, making it versatile for multiple designs. The header boasts a gold plating for the mating interface, enhancing conductivity, while the matte tin plating for termination ensures durability. Its UL 94 V-0 rating confirms its resistance to flame, and the glow-wire capability further exemplifies its safety standards. With a black high-temperature thermoplastic resin construction, it combines sturdiness with functionality for seamless integration into existing systems.
Constructed from black high-temperature thermoplastic resin for durability
Mated height of 16.78mm allows for stable connections
PCB retention features provide secure placement within assemblies
Compatible with lead-free solder processes for eco-friendly manufacturing
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