Molex 105309 Series Vertical Through Hole PCB Header, 7 Contact(s), 2.5 mm Pitch, 1 Row, Shrouded
- RS 제품 번호:
- 787-618
- 제조사 부품 번호:
- 105309-1307
- 제조업체:
- Molex
N
Subtotal (1 Bag of 100 units)*
₩528,767.85
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- 2026년 9월 16일 부터 배송
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Bag(s) | Per Bag | 한팩당* |
|---|---|---|
| 1 + | ₩528,767.85 | ₩5,288.40 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 787-618
- 제조사 부품 번호:
- 105309-1307
- 제조업체:
- Molex
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참조 문서
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Molex | |
| Product Type | PCB Header | |
| Series | 105309 | |
| Current | 8A | |
| Pitch | 2.5mm | |
| Housing Material | Polymer | |
| Number of Contacts | 7 | |
| Number of Rows | 1 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Connector System | Wire-to-Board | |
| Contact Material | Brass | |
| Contact Plating | Gold | |
| Termination Type | Through Hole | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 105°C | |
| Contact Gender | Female | |
| Voltage | 250V | |
| 모두 선택 | ||
|---|---|---|
브랜드 Molex | ||
Product Type PCB Header | ||
Series 105309 | ||
Current 8A | ||
Pitch 2.5mm | ||
Housing Material Polymer | ||
Number of Contacts 7 | ||
Number of Rows 1 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Connector System Wire-to-Board | ||
Contact Material Brass | ||
Contact Plating Gold | ||
Termination Type Through Hole | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 105°C | ||
Contact Gender Female | ||
Voltage 250V | ||
- COO (Country of Origin):
- CN
The Molex Connector is a Compact and efficient connection solution featuring a vertical header design suited for tight spaces while ensuring reliable electrical performance across applications.
Kinked pins enhance retention in PCB applications
Designed for a 2.50mm pitch, optimising space usage
Plated with 0.76μm gold for improved conductivity and corrosion resistance
Glow-wire capable for increased safety in high-temperature environments
Available in tray packaging for streamlined integration into assembly processes
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