Molex 42002 Series Vertical Through Hole PCB Header, 15 Contact(s), 6.35 mm Pitch, 3 Row, Unshrouded
- RS 제품 번호:
- 787-138
- 제조사 부품 번호:
- 10-84-4150
- 제조업체:
- Molex
N
Subtotal (1 tray of 200 units)*
₩636,361.05
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- 2026년 12월 22일 부터 배송
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Tray(s) | Per Tray | 한팩당* |
|---|---|---|
| 1 + | ₩636,361.05 | ₩3,182.40 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 787-138
- 제조사 부품 번호:
- 10-84-4150
- 제조업체:
- Molex
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참조 문서
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제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Molex | |
| Series | 42002 | |
| Product Type | PCB Header | |
| Pitch | 6.35mm | |
| Current | 20A | |
| Housing Material | Nylon | |
| Number of Contacts | 15 | |
| Number of Rows | 3 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Unshrouded | |
| Connector System | Wire-to-Board | |
| Mount Type | Through Hole | |
| Contact Plating | Tin | |
| Contact Material | Bronze | |
| Termination Type | Through Hole | |
| Minimum Operating Temperature | -55°C | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | UL | |
| 모두 선택 | ||
|---|---|---|
브랜드 Molex | ||
Series 42002 | ||
Product Type PCB Header | ||
Pitch 6.35mm | ||
Current 20A | ||
Housing Material Nylon | ||
Number of Contacts 15 | ||
Number of Rows 3 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Unshrouded | ||
Connector System Wire-to-Board | ||
Mount Type Through Hole | ||
Contact Plating Tin | ||
Contact Material Bronze | ||
Termination Type Through Hole | ||
Minimum Operating Temperature -55°C | ||
Contact Gender Male | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals UL | ||
- COO (Country of Origin):
- IN
The Molex Header features a reliable connection system designed for PCB applications, ensuring seamless integration within various electronic devices while maintaining optimal performance standards.
Enhanced durability through high-quality materials for improved longevity
Compact design facilitates integration into space-constrained environments
Versatile connector types accommodate diverse application requirements
Designed to support high-speed data transmissions with minimal signal degradation
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