TE Connectivity 1-17345 Series Vertical Surface PCB Header, 10 Contact(s), 1 mm Pitch, 1 Row, Shrouded
- RS 제품 번호:
- 787-048
- 제조사 부품 번호:
- 1-1734595-0
- 제조업체:
- TE Connectivity
N
Subtotal (1 reel of 1000 units)*
₩3,837,845.70
제조사가 재고 비축중
- 2026년 9월 25일 부터 배송 준비 완료
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릴당 | 릴당 | 한팩당* |
|---|---|---|
| 1 + | ₩3,837,845.70 | ₩3,837.60 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 787-048
- 제조사 부품 번호:
- 1-1734595-0
- 제조업체:
- TE Connectivity
사양
참조 문서
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제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | TE Connectivity | |
| Product Type | PCB Header | |
| Series | 1-17345 | |
| Current | 3A | |
| Pitch | 1mm | |
| Housing Material | Thermoplastic | |
| Number of Contacts | 10 | |
| Number of Rows | 1 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Surface | |
| Connector System | Wire-to-Board | |
| Contact Plating | Tin | |
| Contact Material | Bronze | |
| Termination Type | Surface Mount | |
| Contact Gender | Male | |
| Standards/Approvals | RoHS | |
| Voltage | 50V | |
| 모두 선택 | ||
|---|---|---|
브랜드 TE Connectivity | ||
Product Type PCB Header | ||
Series 1-17345 | ||
Current 3A | ||
Pitch 1mm | ||
Housing Material Thermoplastic | ||
Number of Contacts 10 | ||
Number of Rows 1 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Surface | ||
Connector System Wire-to-Board | ||
Contact Plating Tin | ||
Contact Material Bronze | ||
Termination Type Surface Mount | ||
Contact Gender Male | ||
Standards/Approvals RoHS | ||
Voltage 50V | ||
- COO (Country of Origin):
- CN
The TE Connectivity PCB Header provides a highly flexible interconnection solution designed for PCB applications, facilitating seamless signal and low power routing between circuit boards.
1.0mm to 2.5mm centreline pitch allows versatile design options
Polarized design prevents incorrect insertion and enhances reliability
Available in vertical and horizontal mount styles for tailored fit
Supports through hole (DIP) and surface mount termination for compatibility
Latching options enhance connection stability in critical applications
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