Molex 4455 Series Vertical Surface PCB Header, 6 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded
- RS 제품 번호:
- 786-585
- 제조사 부품 번호:
- 22-02-2065
- 제조업체:
- Molex
N
Subtotal (1 tray of 400 units)*
₩505,381.50
제조사가 재고 비축중
- 2026년 12월 02일 부터 배송 준비 완료
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Tray(s) | Per Tray | 한팩당* |
|---|---|---|
| 1 + | ₩505,381.50 | ₩1,263.60 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 786-585
- 제조사 부품 번호:
- 22-02-2065
- 제조업체:
- Molex
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참조 문서
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제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Molex | |
| Product Type | PCB Header | |
| Series | 4455 | |
| Current | 2.5A | |
| Pitch | 2.54mm | |
| Housing Material | Polymer | |
| Number of Contacts | 6 | |
| Number of Rows | 1 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Wire-to-Board | |
| Mount Type | Surface | |
| Contact Material | Brass | |
| Contact Plating | Tin | |
| Row Pitch | 1mm | |
| Minimum Operating Temperature | -40°C | |
| Termination Type | Surface Mount | |
| Maximum Operating Temperature | 105°C | |
| Voltage | 500V | |
| 모두 선택 | ||
|---|---|---|
브랜드 Molex | ||
Product Type PCB Header | ||
Series 4455 | ||
Current 2.5A | ||
Pitch 2.54mm | ||
Housing Material Polymer | ||
Number of Contacts 6 | ||
Number of Rows 1 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Wire-to-Board | ||
Mount Type Surface | ||
Contact Material Brass | ||
Contact Plating Tin | ||
Row Pitch 1mm | ||
Minimum Operating Temperature -40°C | ||
Termination Type Surface Mount | ||
Maximum Operating Temperature 105°C | ||
Voltage 500V | ||
- COO (Country of Origin):
- MY
The Molex Board Connector is designed to provide reliable connections for PCB headers and receptacles, facilitating efficient electronic assemblies. It ensures stable performance Crucial for various applications in connectors technology.
Delivers robust connection solutions for electronic components
Facilitates seamless integration in complex assemblies
Optimized for durability under demanding operational conditions
Supports versatile application requirements across connectors sectors
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