Molex 4455 Series Vertical Surface Mount PCB Header, 6 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded
- RS 제품 번호:
- 786-585
- 제조사 부품 번호:
- 22-02-2065
- 제조업체:
- Molex
N
Subtotal (1 tray of 400 units)*
₩505,381.50
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- 2026년 10월 19일 부터 배송
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Tray(s) | Per Tray | 한팩당* |
|---|---|---|
| 1 + | ₩505,381.50 | ₩1,263.60 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 786-585
- 제조사 부품 번호:
- 22-02-2065
- 제조업체:
- Molex
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참조 문서
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제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Molex | |
| Series | 4455 | |
| Product Type | PCB Header | |
| Current | 2.5A | |
| Pitch | 2.54mm | |
| Housing Material | Polymer | |
| Number of Contacts | 6 | |
| Number of Rows | 1 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Surface Mount | |
| Connector System | Wire-to-Board | |
| Contact Plating | Tin | |
| Contact Material | Brass | |
| Row Pitch | 1mm | |
| Termination Type | Surface Mount | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 105°C | |
| Voltage | 500V | |
| 모두 선택 | ||
|---|---|---|
브랜드 Molex | ||
Series 4455 | ||
Product Type PCB Header | ||
Current 2.5A | ||
Pitch 2.54mm | ||
Housing Material Polymer | ||
Number of Contacts 6 | ||
Number of Rows 1 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Surface Mount | ||
Connector System Wire-to-Board | ||
Contact Plating Tin | ||
Contact Material Brass | ||
Row Pitch 1mm | ||
Termination Type Surface Mount | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 105°C | ||
Voltage 500V | ||
- COO (Country of Origin):
- MY
The Molex Board Connector is designed to provide reliable connections for PCB headers and receptacles, facilitating efficient electronic assemblies. It ensures stable performance Crucial for various applications in connectors technology.
Delivers robust connection solutions for electronic components
Facilitates seamless integration in complex assemblies
Optimized for durability under demanding operational conditions
Supports versatile application requirements across connectors sectors
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