Molex 70545 Series Vertical Through Hole Header, 4 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded

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RS 제품 번호:
694-158
제조사 부품 번호:
70545-0038
제조업체:
Molex
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브랜드

Molex

Product Type

Header

Series

70545

Current

3A

Pitch

2.54mm

Number of Contacts

4

Housing Material

High Temperature Thermoplastic

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Contact Plating

Gold

Contact Material

Brass and Phosphor Bronze

Termination Type

Solder

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

105°C

Tail Pin Length

3.3mm

Standards/Approvals

RoHS Compliant

Voltage

250V

COO (Country of Origin):
MY
The Molex SL Header represents a robust solution for reliable signal transmission in electronic designs. Designed with a 2.54mm pitch and featuring a single row configuration, it accommodates four circuits within a 3.05mm pocket vertical format. Its shrouded design, complemented by a press-fit plastic peg, ensures secure connections in various applications. With a net weight of just 0.879g, this Compact header is engineered to withstand up to 50 mating cycles, making it an Ideal choice for both durability and performance. The header's compatibility with through-hole termination and its operable temperature range from -40° to +105°C highlight its versatility for diverse environments. Ideal for PCB headers and receptacles, it seamlessly integrates into your projects, ensuring efficient connectivity.

Designed for secure connections with a press-fit plastic peg

Accommodates four circuits in a Compact footprint for space efficiency

Durability of up to 50 mating cycles ensures long-term reliability

Operable in a broad temperature range from -40° to +105°C for versatile application

Utilises high-temperature thermoplastic resin for improved performance and safety

Gold selective plating enhances conductivity while tin plating offers reliable termination

PCB retention features secure the header in place, reducing assembly issues

Orientation is vertical for straightforward integration into designs

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