Molex 70543 Series Vertical PCB Header, 18 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded

N

Subtotal (1 tube of 50 units)*

₩392,958.15

Add to Basket
수량 선택 또는 입력
제조사가 재고 비축중
  • 2026년 7월 17일 부터 배송 준비 완료
더 자세한 내용이 필요하신가요? 필요한 수량을 입력하고 '배송일 확인'을 클릭하면 더 많은 재고 및 배송 세부정보를 확인하실 수 있습니다.
Tube(s)
Per Tube
한팩당*
1 +₩392,958.15₩7,858.50

* 참고 가격: 실제 구매가격과 다를 수 있습니다

RS 제품 번호:
693-598
제조사 부품 번호:
70543-0052
제조업체:
Molex
제품 정보를 선택해 유사 제품을 찾기
모두 선택

브랜드

Molex

Product Type

Header

Series

70543

Pitch

2.54mm

Current

3A

Number of Contacts

18

Housing Material

High Temperature Thermoplastic

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

PCB

Contact Plating

Tin

Contact Material

Brass and Phosphor Bronze

Termination Type

Through Hole

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

105°C

Tail Pin Length

3.3mm

Standards/Approvals

RoHS Compliant

Voltage

250V

COO (Country of Origin):
MY
The Molex SL Header is a highly versatile solution designed for reliable wire-to-board connections in various electronic applications. This single-row vertical header boasts a 2.54mm pitch and features shrouded design with 18 circuits, ensuring a secure and robust interconnection. Ideal for PCB headers and receptacles, it offers excellent durability with up to 25 mating cycles, making it suitable for high-performance requirements. The header is constructed from high-temperature thermoplastic and brass, providing resilience against harsh environments while maintaining compliance with critical industry standards. Whether for signal applications or more demanding uses, the SL Header ensures optimal functionality for your designs.

Constructed with high-temperature thermoplastic for durability and reliability

Features 18 circuits for efficient signal transmission and board space optimisation

Utilises tin plating for excellent conductivity and corrosion resistance

Designed for through-hole soldering, facilitating easier PCB integration

Vertical orientation enables efficient use of space in Compact electronic designs

Solder process capability includes a lead-free process option, promoting environmental compliance

Compatible with various single-row crimp housings and insulation displacement connectors

Meets compliance standards including EU RoHS and REACH, ensuring safety and regulatory adherence

관련된 링크들