Molex 43045 Series Vertical Through Hole Header, 16 Contact(s), 3 mm Pitch, 2 Row, Shrouded
- RS 제품 번호:
- 693-469
- 제조사 부품 번호:
- 43045-1626
- 제조업체:
- Molex
N
Subtotal (1 tray of 50 units)*
₩408,428.12
일시적 품절
- 2026년 4월 20일 부터 배송
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Tray(s) | Per Tray | 한팩당* |
|---|---|---|
| 1 + | ₩408,428.12 | ₩8,168.60 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 693-469
- 제조사 부품 번호:
- 43045-1626
- 제조업체:
- Molex
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Molex | |
| Product Type | Header | |
| Series | 43045 | |
| Pitch | 3mm | |
| Current | 8.5A | |
| Number of Contacts | 16 | |
| Housing Material | High Temperature Thermoplastic | |
| Number of Rows | 2 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Connector System | Wire-to-Board | |
| Contact Material | Brass | |
| Contact Plating | Gold | |
| Minimum Operating Temperature | -40°C | |
| Termination Type | Through Hole | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | UL E29179, CSA LR19980 | |
| 모두 선택 | ||
|---|---|---|
브랜드 Molex | ||
Product Type Header | ||
Series 43045 | ||
Pitch 3mm | ||
Current 8.5A | ||
Number of Contacts 16 | ||
Housing Material High Temperature Thermoplastic | ||
Number of Rows 2 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Connector System Wire-to-Board | ||
Contact Material Brass | ||
Contact Plating Gold | ||
Minimum Operating Temperature -40°C | ||
Termination Type Through Hole | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals UL E29179, CSA LR19980 | ||
- COO (Country of Origin):
- CN
The Molex Micro-Fit 3.0 Vertical Header is designed for reliable power and signal connectivity in Compact electronic applications. With a 3.00mm pitch and accommodating up to 16 circuits, this dual-row header features a PCB press-fit metal retention clip and gold plating, ensuring robust performance and durability. Engineered for high-temperature environments, it supports a temperature range from -40° to +125°C and meets various industry compliance standards, making it Ideal for demanding applications. The Micro-Fit 3.0 series is perfect for wire-to-board connections, providing a secure and efficient Interface for your electronic assemblies.
Glow-wire capable, ensuring safety in high-temperature applications
Lightweight at just 2.284g without compromising strength
Meets rigorous compliance standards, including EU RoHS and REACH SVHC, for environmental responsibility
Perfectly pairs with corresponding receptacle parts for seamless connectivity
Built for reliability with a minimum plating thickness of 0.762μm on mating surfaces, enhancing durability
Lightweight at just 2.284g without compromising strength
Meets rigorous compliance standards, including EU RoHS and REACH SVHC, for environmental responsibility
Perfectly pairs with corresponding receptacle parts for seamless connectivity
Built for reliability with a minimum plating thickness of 0.762μm on mating surfaces, enhancing durability
관련된 링크들
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