Molex 87832 Series Vertical Surface Mount PCB Header, 16 Contact(s), 2 mm Pitch, 2 Row, Shrouded

Subtotal (1 tube of 200 units)*

₩591,380.32

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  • 2026년 6월 01일 부터 배송
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Tube(s)
Per Tube
한팩당*
1 +₩591,380.32₩2,957.24

* 참고 가격: 실제 구매가격과 다를 수 있습니다

RS 제품 번호:
691-594
제조사 부품 번호:
87832-1623
제조업체:
Molex
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브랜드

Molex

Product Type

PCB Header

Series

87832

Pitch

2mm

Current

2A

Number of Contacts

16

Housing Material

Nylon

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Surface Mount

Connector System

PCB Header

Contact Plating

Gold

Contact Material

Phosphor Bronze

Minimum Operating Temperature

-55°C

Termination Type

Surface Mount

Maximum Operating Temperature

105°C

Contact Gender

Male

Standards/Approvals

CSA LR19980, UL E29179

Voltage

125V

COO (Country of Origin):
MY
The Molex Milli Grid PCB header is engineered for high-density applications, featuring a robust dual-row design with a 2.00mm pitch. This versatile component provides a secure and efficient Interface for signal and wire-to-board connections. Its surface mount configuration allows for space-saving integration on printed circuit boards, making it an excellent choice for Compact electronic designs. Built with durability in mind, this header is rated for up to 100 mating cycles and is designed to withstand extreme temperatures ranging from -55°C to +105°C. With lead-free construction and compliance to EU RoHS standards, this product is environmentally friendly without compromising on performance.

Dual-row format optimises space for high-density applications
Designed for surface mount, ensuring easy and efficient PCB integration
Compatible with a variety of receptacles, enhancing versatility in use
Lead-free construction aligns with modern environmental compliance standards
Durability rated at 100 mating cycles to ensure long-term reliability
Operates effectively in a wide temperature range, suitable for various environments
Integrated PCB locator aids in accurate placement during assembly
Includes pick-and-place capabilities for effortless robotic handling

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