Molex 90130 Series Right Angle Through Hole PCB Header, 50 Contact(s), 2.54 mm Pitch, 2 Row, Shrouded
- RS 제품 번호:
- 691-225
- 제조사 부품 번호:
- 90130-3350
- 제조업체:
- Molex
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- RS 제품 번호:
- 691-225
- 제조사 부품 번호:
- 90130-3350
- 제조업체:
- Molex
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Molex | |
| Product Type | PCB Header | |
| Series | 90130 | |
| Pitch | 2.54mm | |
| Current | 3A | |
| Housing Material | Polyester | |
| Number of Contacts | 50 | |
| Number of Rows | 2 | |
| Orientation | Right Angle | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Connector System | Wire-to-Board | |
| Contact Material | Brass | |
| Contact Plating | Gold | |
| Minimum Operating Temperature | -55°C | |
| Row Pitch | 2.54mm | |
| Termination Type | Through Hole | |
| Maximum Operating Temperature | 125°C | |
| Tail Pin Length | 2.90mm | |
| Standards/Approvals | RoHS | |
| Mating Pin Length | 2.9mm | |
| 모두 선택 | ||
|---|---|---|
브랜드 Molex | ||
Product Type PCB Header | ||
Series 90130 | ||
Pitch 2.54mm | ||
Current 3A | ||
Housing Material Polyester | ||
Number of Contacts 50 | ||
Number of Rows 2 | ||
Orientation Right Angle | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Connector System Wire-to-Board | ||
Contact Material Brass | ||
Contact Plating Gold | ||
Minimum Operating Temperature -55°C | ||
Row Pitch 2.54mm | ||
Termination Type Through Hole | ||
Maximum Operating Temperature 125°C | ||
Tail Pin Length 2.90mm | ||
Standards/Approvals RoHS | ||
Mating Pin Length 2.9mm | ||
- COO (Country of Origin):
- MY
The Molex C-Grid III header is designed to facilitate efficient signal transmission with ease of integration in Compact electronic systems. Featuring a dual-row, right-angle configuration, this fully loaded header accommodates up to 50 circuits, making it Ideal for applications where space is at a premium. It is constructed with Durable materials, including brass metal plating, ensuring reliability under various operating conditions. With an operating temperature range of -55° to +125°C, this product is suitable for diverse environments, while its precise dimensions and plating specifications support superior connectivity. The combination of selective gold plating and robust polyester resin enhances performance and prolongs device longevity, establishing the C-Grid III as a versatile solution for wire-to-board connections.
Resin material is polyester, offering resilience against environmental challenges
Rated for a maximum current of 3.0A, ensuring efficient power transmission
Compatible with a variety of crimp housings for flexible application options
Temperature range supports diverse operational environments from -55° to +125°C
Complies with industry standards, ensuring consistent product quality and safety
Rated for a maximum current of 3.0A, ensuring efficient power transmission
Compatible with a variety of crimp housings for flexible application options
Temperature range supports diverse operational environments from -55° to +125°C
Complies with industry standards, ensuring consistent product quality and safety
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