Molex 71850 Series Vertical Through Hole PCB Header Pin, 18 Contact(s), 2.54 mm Pitch, 2 Row, Shrouded
- RS 제품 번호:
- 685-098
- 제조사 부품 번호:
- 15-44-6818
- 제조업체:
- Molex
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- RS 제품 번호:
- 685-098
- 제조사 부품 번호:
- 15-44-6818
- 제조업체:
- Molex
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Molex | |
| Series | 71850 | |
| Product Type | PCB Header Pin | |
| Pitch | 2.54mm | |
| Current | 2.5A | |
| Housing Material | Thermoplastic | |
| Number of Contacts | 18 | |
| Number of Rows | 2 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Contact Material | Phosphor Bronze | |
| Contact Plating | Gold | |
| Termination Type | Solder | |
| Row Pitch | 2.54mm | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | RoHS | |
| Voltage | 500V | |
| 모두 선택 | ||
|---|---|---|
브랜드 Molex | ||
Series 71850 | ||
Product Type PCB Header Pin | ||
Pitch 2.54mm | ||
Current 2.5A | ||
Housing Material Thermoplastic | ||
Number of Contacts 18 | ||
Number of Rows 2 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Contact Material Phosphor Bronze | ||
Contact Plating Gold | ||
Termination Type Solder | ||
Row Pitch 2.54mm | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals RoHS | ||
Voltage 500V | ||
- COO (Country of Origin):
- MY
The Molex C-Grid Receptacle is engineered to facilitate reliable board-to-board connections in various electronic applications. Designed with a 2.54mm pitch, this dual-row receptacle supports high-temperature performance with a robust construction for 18 circuits. Perfect for environments requiring durability and efficiency, the C-Grid receptacle stands out with its vertical orientation and through-hole termination style, making it a versatile choice for modern PCB designs. Its compliance with industry standards ensures it meets rigorous safety and quality requirements, offering peace of mind for your connectivity solutions.
No glow-wire capability enhances safety in critical applications
Lead-free process capability supports eco-friendly manufacturing
Mating interfaces designed specifically for dual-row configurations
Compatible with several C-Grid header options for enhanced versatility
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