Molex 71308 Series Vertical Surface PCB Header, 14 Contact(s), 2.54 mm Pitch, 2 Row, Unshrouded
- RS 제품 번호:
- 684-897
- 제조사 부품 번호:
- 15-91-3140
- 제조업체:
- Molex
N
Subtotal (1 tube of 180 units)*
₩505,631.64
일시적 품절
- 2026년 6월 02일 부터 배송
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Tube(s) | Per Tube | 한팩당* |
|---|---|---|
| 1 + | ₩505,631.64 | ₩2,808.72 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 684-897
- 제조사 부품 번호:
- 15-91-3140
- 제조업체:
- Molex
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참조 문서
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제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Molex | |
| Series | 71308 | |
| Product Type | PCB Header | |
| Pitch | 2.54mm | |
| Current | 3A | |
| Number of Contacts | 14 | |
| Housing Material | Thermoplastic | |
| Number of Rows | 2 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Unshrouded | |
| Mount Type | Surface | |
| Contact Material | Phosphor Bronze | |
| Contact Plating | Gold | |
| Minimum Operating Temperature | -40°C | |
| Row Pitch | 2.54mm | |
| Termination Type | Solder | |
| Maximum Operating Temperature | 120°C | |
| Standards/Approvals | RoHS | |
| Voltage | 250 V | |
| 모두 선택 | ||
|---|---|---|
브랜드 Molex | ||
Series 71308 | ||
Product Type PCB Header | ||
Pitch 2.54mm | ||
Current 3A | ||
Number of Contacts 14 | ||
Housing Material Thermoplastic | ||
Number of Rows 2 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Unshrouded | ||
Mount Type Surface | ||
Contact Material Phosphor Bronze | ||
Contact Plating Gold | ||
Minimum Operating Temperature -40°C | ||
Row Pitch 2.54mm | ||
Termination Type Solder | ||
Maximum Operating Temperature 120°C | ||
Standards/Approvals RoHS | ||
Voltage 250 V | ||
- COO (Country of Origin):
- MY
The Molex C-Grid Breakaway Header is expertly designed for seamless board-to-board and wire-to-board applications, ensuring reliable connectivity in electronic devices. Featuring a dual-row, vertical configuration with 14 circuits, it employs a precise 2.54mm pitch to facilitate optimal performance. This header is characterized by its durable construction, utilizing high-temperature thermoplastic resin, and is finished with a combination of gold and tin plating to enhance conductivity and longevity. Ideal for applications requiring robust connections, this component promises dependable electrical performance while maintaining a low halogen status, aligning with modern environmental standards.
Designed without PCB locator pegs, allowing for flexible mounting options
Surface mount design simplifies PCB assembly processes
Stackable configuration facilitates compact arrangements in multi-layer applications
Low-halogen materials comply with stringent environmental and safety regulations
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