Molex 215760 Series Right Angle Through Hole PCB Header, 7 Contact(s), 3 mm Pitch, 1 Row, Shrouded
- RS 제품 번호:
- 684-424
- 제조사 부품 번호:
- 215760-1007
- 제조업체:
- Molex
N
Subtotal (1 tray of 150 units)*
₩421,377.56
일시적 품절
- 2026년 5월 29일 부터 배송
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Tray(s) | Per Tray | 한팩당* |
|---|---|---|
| 1 + | ₩421,377.56 | ₩2,808.72 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 684-424
- 제조사 부품 번호:
- 215760-1007
- 제조업체:
- Molex
사양
참조 문서
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제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Molex | |
| Series | 215760 | |
| Product Type | PCB Header | |
| Pitch | 3mm | |
| Number of Contacts | 7 | |
| Number of Rows | 1 | |
| Orientation | Right Angle | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Row Pitch | 3mm | |
| Standards/Approvals | RoHS | |
| 모두 선택 | ||
|---|---|---|
브랜드 Molex | ||
Series 215760 | ||
Product Type PCB Header | ||
Pitch 3mm | ||
Number of Contacts 7 | ||
Number of Rows 1 | ||
Orientation Right Angle | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Row Pitch 3mm | ||
Standards/Approvals RoHS | ||
- COO (Country of Origin):
- CN
The Molex Micro-Fit+ Right-Angle Header is an advanced interconnect solution designed for efficient power distribution in various electronic applications. This header features a robust single-row configuration with seven circuits, making it ideal for use in environments requiring space-saving designs. The 3.00mm pitch optimises board space while ensuring reliable connection integrity, and the matte tin plating contributes to enhanced conductivity. The Micro-Fit+ design is glow-wire capable, allowing it to perform safely in high-temperature conditions, while its black liquid crystal polymer construction offers durability and resistance to various environmental factors. Whether for power or wire-to-board applications, this header is built to meet the rigorous demands of modern electronic systems.
Glow wire capable design enhances safety in high temperature environments
Black resin construction delivers durability and resistance to external factors
Matte tin plating ensures excellent conductivity and reliability
Single row, seven circuit configuration optimises space in compact designs
PCB retention feature provides secure mounting on the board
Ideal for power and wire to board applications, enhancing system performance
Utilises high copper alloy for effective electrical conductivity
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