TE Connectivity MTA-100 Series Right Angle PCB Header, 4 Contact(s), 2.54 mm Pitch, 1 Row, Unshrouded
- RS 제품 번호:
- 678-797
- 제조사 부품 번호:
- 641127-4
- 제조업체:
- TE Connectivity
N
Subtotal (1 pack of 200 units)*
₩485,700.00
제조사가 재고 비축중
- 2026년 10월 13일 부터 배송 준비 완료
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팩 | 한팩당 | 한팩당* |
|---|---|---|
| 1 + | ₩485,700.00 | ₩2,428.00 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 678-797
- 제조사 부품 번호:
- 641127-4
- 제조업체:
- TE Connectivity
사양
참조 문서
제정법과 컴플라이언스
제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | TE Connectivity | |
| Series | MTA-100 | |
| Product Type | Header | |
| Pitch | 2.54mm | |
| Number of Contacts | 4 | |
| Number of Rows | 1 | |
| Orientation | Right Angle | |
| Shrouded/Unshrouded | Unshrouded | |
| Mount Type | PCB | |
| Contact Plating | Gold | |
| Contact Material | Copper Alloy | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | 105°C | |
| Contact Gender | Male | |
| Standards/Approvals | UL | |
| 모두 선택 | ||
|---|---|---|
브랜드 TE Connectivity | ||
Series MTA-100 | ||
Product Type Header | ||
Pitch 2.54mm | ||
Number of Contacts 4 | ||
Number of Rows 1 | ||
Orientation Right Angle | ||
Shrouded/Unshrouded Unshrouded | ||
Mount Type PCB | ||
Contact Plating Gold | ||
Contact Material Copper Alloy | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature 105°C | ||
Contact Gender Male | ||
Standards/Approvals UL | ||
- COO (Country of Origin):
- US
The TE Connectivity Header Assembly is a 4-position wire-to-board connector designed for signal applications in Compact electronic systems. It features flat-style right-angle pins with 15 microinches of gold plating over nickel, offering excellent conductivity and long-term durability. As part of the MTA 100 series, it supports quick IDC termination and is Ideal for automated assembly environments.
4-position configuration for low to mid-range signal connections
Flat-style right-angle pins with 15μin gold plating for enhanced contact reliability
Compatible with MTA 100 IDC receptacles for efficient wire-to-board integration
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