TE Connectivity Z-PACK 2mm HM Series Right Angle Board Receptacle, 125 Contact(s), 2 mm Pitch, 5 Row, Shrouded
- RS 제품 번호:
- 678-762
- 제조사 부품 번호:
- 5646547-1
- 제조업체:
- TE Connectivity
N
Subtotal (1 tube of 20 units)*
₩580,448.12
현재 액세스할 수 없는 재고 정보 - 나중에 다시 확인해 주세요.
Tube(s) | Per Tube | 한팩당* |
|---|---|---|
| 1 + | ₩580,448.12 | ₩29,023.44 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 678-762
- 제조사 부품 번호:
- 5646547-1
- 제조업체:
- TE Connectivity
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | TE Connectivity | |
| Product Type | Receptacle | |
| Series | Z-PACK 2mm HM | |
| Current | 1.5A | |
| Pitch | 2mm | |
| Number of Contacts | 125 | |
| Housing Material | Glass Filled Polyester | |
| Number of Rows | 5 | |
| Orientation | Right Angle | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Board | |
| Connector System | Board-to-Board | |
| Contact Material | Phosphor Bronze | |
| Contact Plating | Gold | |
| Minimum Operating Temperature | -55°C | |
| Termination Type | Through Hole | |
| Contact Gender | Female | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | UL | |
| 모두 선택 | ||
|---|---|---|
브랜드 TE Connectivity | ||
Product Type Receptacle | ||
Series Z-PACK 2mm HM | ||
Current 1.5A | ||
Pitch 2mm | ||
Number of Contacts 125 | ||
Housing Material Glass Filled Polyester | ||
Number of Rows 5 | ||
Orientation Right Angle | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Board | ||
Connector System Board-to-Board | ||
Contact Material Phosphor Bronze | ||
Contact Plating Gold | ||
Minimum Operating Temperature -55°C | ||
Termination Type Through Hole | ||
Contact Gender Female | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals UL | ||
- COO (Country of Origin):
- CN
The TE Connectivity Hard Metric Backplane PCB Mount Receptacle designed for high-speed mezzanine applications requiring up to 1 Gb/s data transmission. It features a 125-position layout arranged in 25 columns and 5 rows, optimized for dense signal routing in modular systems. The right-angle configuration supports edge-mounted PCB integration, making it Ideal for Compact backplane architectures.
2 mm centerline pitch enables efficient high-density interconnects
Mezzanine style supports vertical stacking in multi-board systems
Right-angle mounting allows streamlined board-edge connectivity
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