Phoenix Contact MCDN Series Straight Wave Soldering Mount PCB Header, 30 Contact(s), 3.5 mm Pitch, 2 Row, Shrouded
- RS 제품 번호:
- 556-625
- 제조사 부품 번호:
- 1953842
- 제조업체:
- Phoenix Contact
Subtotal (1 pack of 40 units)*
₩1,763,831.04
일시적 품절
- 2026년 2월 13일 부터 배송
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팩 | 한팩당 | 한팩당* |
|---|---|---|
| 1 + | ₩1,763,831.04 | ₩44,095.40 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 556-625
- 제조사 부품 번호:
- 1953842
- 제조업체:
- Phoenix Contact
사양
참조 문서
제정법과 컴플라이언스
제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Phoenix Contact | |
| Product Type | PCB Header | |
| Series | MCDN | |
| Current | 8A | |
| Pitch | 3.5mm | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Contacts | 30 | |
| Number of Rows | 2 | |
| Orientation | Straight | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | COMBICON FMC 1 | |
| Mount Type | Wave Soldering Mount | |
| Contact Material | Copper Alloy | |
| Row Pitch | 3.5mm | |
| Termination Type | Solder | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 100°C | |
| Tail Pin Length | 2.6mm | |
| Contact Gender | Male | |
| Standards/Approvals | cULus Recognised, VDE approval of drawings | |
| Mating Pin Length | 2.6mm | |
| Voltage | 160 V | |
| 모두 선택 | ||
|---|---|---|
브랜드 Phoenix Contact | ||
Product Type PCB Header | ||
Series MCDN | ||
Current 8A | ||
Pitch 3.5mm | ||
Housing Material Liquid Crystal Polymer | ||
Number of Contacts 30 | ||
Number of Rows 2 | ||
Orientation Straight | ||
Shrouded/Unshrouded Shrouded | ||
Connector System COMBICON FMC 1 | ||
Mount Type Wave Soldering Mount | ||
Contact Material Copper Alloy | ||
Row Pitch 3.5mm | ||
Termination Type Solder | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 100°C | ||
Tail Pin Length 2.6mm | ||
Contact Gender Male | ||
Standards/Approvals cULus Recognised, VDE approval of drawings | ||
Mating Pin Length 2.6mm | ||
Voltage 160 V | ||
- COO (Country of Origin):
- DE
The Phoenix Contact PCB header offers an advanced solution for connecting multiple circuits seamlessly. Engineered for integration into the SMT soldering process, this versatile component is designed to meet the demanding needs of modern electronic devices. Its compact structure allows for a high contact density while maintaining a robust performance across a variety of applications. With features tailored for through-hole reflow technology, the products reliability is underscored by its rich specifications, making it an ideal choice for manufacturers seeking efficiency and effectiveness. The reliable connection ensures optimal functionality, while its carefully selected materials guarantee compliance with international standards, catering to both performance and environmental considerations.
Designed for flexible device integration with various connection technologies
Facilitates higher contact density through multi-level conductor connection
Optimised for both reflow and wave soldering techniques
Lightweight design contributes to easier handling and assembly
RoHS-compliant, ensuring environmental sustainability
Features linear pinning for enhanced stability during operation
Accommodates a diverse range of applications within electronic circuitry
Superior electrical properties enhance overall performance
Packaging is efficient, minimising waste and supporting eco-friendly practices
관련된 링크들
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