TE Connectivity AMPMODU Series Vertical Board PCB Header, 14 Contact(s), 2.54 mm Pitch, 2 Row, Unshrouded
- RS 재고 번호:
- 505-894
- 제조 부품 번호:
- 5-146256-7
- 제조업체:
- TE Connectivity
Subtotal (1 pack of 65 units)*
₩360,057.60
현재 액세스할 수 없는 재고 정보
팩 | 한팩당 | 한팩당* |
|---|---|---|
| 1 + | ₩360,057.60 | ₩5,538.48 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 재고 번호:
- 505-894
- 제조 부품 번호:
- 5-146256-7
- 제조업체:
- TE Connectivity
사양
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제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | TE Connectivity | |
| Series | AMPMODU | |
| Product Type | PCB Header | |
| Pitch | 2.54mm | |
| Current | 3A | |
| Housing Material | Thermoplastic | |
| Number of Contacts | 14 | |
| Number of Rows | 2 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Unshrouded | |
| Connector System | Board-to-Board | |
| Mount Type | Board | |
| Contact Material | Phosphor Bronze | |
| Contact Plating | Gold | |
| Minimum Operating Temperature | 65°C | |
| Termination Type | Solder | |
| Row Pitch | 2.54mm | |
| Tail Pin Length | 3.05mm | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | No | |
| Voltage | 30 V | |
| 모두 선택 | ||
|---|---|---|
브랜드 TE Connectivity | ||
Series AMPMODU | ||
Product Type PCB Header | ||
Pitch 2.54mm | ||
Current 3A | ||
Housing Material Thermoplastic | ||
Number of Contacts 14 | ||
Number of Rows 2 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Unshrouded | ||
Connector System Board-to-Board | ||
Mount Type Board | ||
Contact Material Phosphor Bronze | ||
Contact Plating Gold | ||
Minimum Operating Temperature 65°C | ||
Termination Type Solder | ||
Row Pitch 2.54mm | ||
Tail Pin Length 3.05mm | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals No | ||
Voltage 30 V | ||
- COO (Country of Origin):
- US
The TE Connectivity PCB Mount Header is a premium connectivity solution designed for board-to-board applications. Its vertical orientation and breakaway feature provide exceptional versatility for various configurations, making it ideal for modern electronic devices. With 14 positions and a compact 2.54 mm centreline, it accommodates high-density connectivity needs without compromising performance. The combination of gold contact plating and nickel underplating ensures reliable electrical performance and longevity, while its thermoplastic housing withstands challenging operating conditions. Designed for ease of integration, this connector promises to elevate your project with its robust and dependable design.
Vertical orientation enhances space efficiency in PCB layouts
Breakaway design allows for flexible assembly options
Accommodates up to 14 positions, suitable for compact applications
Gold plating ensures superior conductivity and corrosion resistance
Nickel underplating adds durability and reliability
Thermoplastic housing offers protection against environmental factors
Compatible with high-density circuit designs, ensuring versatility
Easily integrates into existing systems for seamless upgrades
Designed for through-hole solder termination, simplifying installation
Robust mechanical attachment supports secure and stable connections
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