Phoenix Contact MDSTBV Series Straight Wave Soldering Mount PCB Header, 24 Contact(s), 5.08 mm Pitch, 2 Row, Shrouded

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RS 제품 번호:
483-586
제조사 부품 번호:
1762606
제조업체:
Phoenix Contact
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브랜드

Phoenix Contact

Series

MDSTBV

Product Type

PCB Header

Pitch

5.08mm

Current

10A

Housing Material

Polyamide

Number of Contacts

24

Number of Rows

2

Orientation

Straight

Shrouded/Unshrouded

Shrouded

Mount Type

Wave Soldering Mount

Connector System

COMBICON MSTB 2.5

Contact Plating

Tin Plated

Contact Material

Copper Alloy

Row Pitch

5.08mm

Termination Type

Solder

Minimum Operating Temperature

-40°C

Tail Pin Length

3.9mm

Contact Gender

Male

Maximum Operating Temperature

100°C

Standards/Approvals

CSA, cULus Recognised, IEC 60068-2-70:1995-12, IEC 60512-1-1:2002-02, IEC 60512-1-2:2002-02, IEC 60512-13-5:2006-02, IEC 60512-15-1:2008-05, IEC 60512-3-1:2002-02, IEC 60512-5-1:2002-02, IEC 60664-1:2007-04, ISO 6988:1985-02, UL 94 V0, VDE

Mating Pin Length

3.9mm

Voltage

32V

COO (Country of Origin):
PL
The Phoenix Contact MDSTBV 2.5/12-G1-5.08 PCB header is designed for versatility in device design, accommodating various connection technologies with ease. Engineered for high-performance applications, this connector boasts a robust construction that supports a nominal current of up to 10 A and a rated voltage of 320 V. With a pitch of 5.08 mm, it facilitates secure connections across 24 potentials and 12 positions. The green-hued housing, compliant with stringent WEEE/RoHS standards, ensures reliable functionality while meeting modern environmental regulations. Built for wave soldering, this connector is straightforward to install while promising longevity and dependable performance in demanding environments. The combination of ease of use and high-density contact arrangements makes it a valuable addition to any PCB layout.

Designed for maximum flexibility in device configurations

Offers easy replacement of PCBs with plug-in modules

Utilises a well-known mounting principle for global compatibility

Enables higher contact density through multi-level conductor connections

Packed in cardboard for sustainable shipping and storage

Exemplifies high reliability in electrical and mechanical performance

Accommodates a variety of connection technologies for broader application

Ensures robust construction to withstand diverse operational environments

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