Phoenix Contact ICV Series Wave Soldering Mount PCB Header, 5 Contact(s), 5.08 mm Pitch, 1 Row, Shrouded

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₩609,962.24

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  • 2026년 2월 10일 부터 배송
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RS 제품 번호:
483-573
제조사 부품 번호:
1825721
제조업체:
Phoenix Contact
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브랜드

Phoenix Contact

Product Type

PCB Header

Series

ICV

Current

12A

Pitch

5.08mm

Housing Material

Polyamide

Number of Contacts

5

Number of Rows

1

Shrouded/Unshrouded

Shrouded

Connector System

COMBICON MSTB 2.5

Mount Type

Wave Soldering Mount

Contact Plating

Tin Plated

Contact Material

Copper Alloy

Termination Type

Solder

Row Pitch

5.08mm

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

105°C

Tail Pin Length

3.6mm

Contact Gender

Female

Mating Pin Length

3.6mm

Standards/Approvals

No

Voltage

32 V

COO (Country of Origin):
DE
The Phoenix Contact ICV 2.5/ 5-GF-5.08 - PCB header is designed for versatile connectivity in electronic applications. This product excels in providing reliable performance with a focus on flexibility, making it suitable for various device designs. With its compact dimensions and high-quality materials, it guarantees robust and stable connections in demanding environments. The inverted design allows for touch-proof outputs and secure PCB connections, ensuring safety and ease of use in assembly and operation. Crafted with precision, this pcb header ensures efficient installation through its wave soldering compatibility, making it an ideal choice for professionals seeking quality and durability in their components.

Offers a reliable and secure connection for your electronic devices

Designed for easy integration into diverse device architectures

Facilitates effortless PCB replacement with its plug-in modules

Complies with international quality standards for reliable usage worldwide

Constructed from high-grade materials to withstand varied operational conditions

Enables easy management of multiple connections via its efficient layout

Features a screw locking mechanism for enhanced stability during operation

Accommodates various connection technologies for maximum versatility

Environmentally compliant, ensuring safe usage across different regions

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