TE Connectivity AMPMODU Series Vertical Board PCB Header, 8 Contact(s), 2.54 mm Pitch, 1 Row, Unshrouded

N

Subtotal (1 pack of 224 units)*

₩443,178.04

Add to Basket
수량 선택 또는 입력
일시적 품절
  • 2026년 1월 26일 부터 배송
더 자세한 내용이 필요하신가요? 필요한 수량을 입력하고 '배송일 확인'을 클릭하면 더 많은 재고 및 배송 세부정보를 확인하실 수 있습니다.
한팩당
한팩당*
1 +₩443,178.04₩1,977.76

* 참고 가격: 실제 구매가격과 다를 수 있습니다

RS 제품 번호:
473-873
제조사 부품 번호:
535541-6
제조업체:
TE Connectivity
제품 정보를 선택해 유사 제품을 찾기
모두 선택

브랜드

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Current

3A

Pitch

2.54mm

Housing Material

Fibreglass Polyester

Number of Contacts

8

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Plating

Gold

Contact Material

Phosphor Bronze

Minimum Operating Temperature

65°C

Termination Type

Solder

Row Pitch

2.54mm

Maximum Operating Temperature

105°C

Tail Pin Length

3.18mm

Standards/Approvals

CSA LR7189, UL E28476

Voltage

333 V

비준수

COO (Country of Origin):
CN
The TE Connectivity Connector System is designed for seamless integration in various electronic applications. This PCB mount receptacle features a vertical orientation and is optimised for board-to-board connections, enabling efficient signal transfer across devices. With eight positions arranged in a single row and a .1 inch centreline, it ensures compact design and maximised performance. The robust construction, including gold-plated contacts and a standard connector profile, guarantees reliable connectivity while accommodating a wide operating temperature range. Its innovative design allows for easy installation through soldering, making it an ideal choice for both prototyping and mass production. Enhanced with a superior dielectric withstand voltage, it promises durability and longevity in demanding environments.

Robust design supports reliable board-to-board connectivity

Vertical orientation optimises space in electronic assemblies

Dielectric withstand voltage ensures enhanced safety during operation

Compact size allows for efficient circuit board layout

Gold plating enhances corrosion resistance and conductivity

Compatible with standard through-hole soldering techniques

Has a wide operating temperature range for versatile applications

Lightweight construction helps reduce overall assembly weight

관련된 링크들