Infineon OptiMOS 3 Type N-Channel MOSFET, 36 A, 200 V Enhancement, 8-Pin TDSON BSC320N20NS3GATMA1

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포장 옵션
RS 제품 번호:
754-5311
제조사 부품 번호:
BSC320N20NS3GATMA1
제조업체:
Infineon
제품 정보를 선택해 유사 제품을 찾기
모두 선택

브랜드

Infineon

Product Type

MOSFET

Channel Type

Type N

Maximum Continuous Drain Current Id

36A

Maximum Drain Source Voltage Vds

200V

Package Type

TDSON

Series

OptiMOS 3

Mount Type

Surface

Pin Count

8

Maximum Drain Source Resistance Rds

32mΩ

Channel Mode

Enhancement

Minimum Operating Temperature

-55°C

Maximum Power Dissipation Pd

125W

Typical Gate Charge Qg @ Vgs

22nC

Forward Voltage Vf

1.2V

Maximum Operating Temperature

150°C

Height

1.1mm

Standards/Approvals

No

Length

5.35mm

Automotive Standard

No

Infineon OptiMOS 3 Series MOSFET, 200V Drain Source Voltage, 36A Continuous Drain Current - BSC320N20NS3GATMA1


This MOSFET is a high-voltage N-channel switching transistor designed for compact surface-mount power conversion and switching applications. It operates across a wide ambient range and is intended for duty in demanding thermal environments, providing a balance of blocking capability and current handling for medium-power designs.

Features and Benefits:


• 200V drain-source rating enables high-voltage switching capacity
• 36A continuous drain current supports substantial load currents
• 32mΩ low Rds(on) reduces conduction losses during operation
• 125W maximum power dissipation permits high-power handling
• 22nC typical gate charge enables efficient gate-drive switching
• Vgs tolerance up to 20V allows flexible drive voltages

Applications


• Suitable for switch-mode power supplies in industrial systems
• Ideal for DC-DC converters requiring high-voltage switching
• Used for motor-drive stages with significant current demands
• Can be used for power-factor correction circuits in supplies
• Suitable for telecoms and server power delivery modules

What thermal extremes can the device withstand during operation?


It is specified to function from -55°C up to 150°C, accommodating wide temperature excursions in both cold-start and high-temperature environments.

How does the package influence PCB layout considerations?


The TDSON surface-mount package has a low profile and requires attention to thermal pad design for heat dissipation and correct soldering footprint to maintain thermal performance.

What gate-drive characteristics are needed for fast switching?


Expect to drive the gate up to 20V

the typical 22nC gate charge should be considered when selecting gate drivers to balance switching speed and drive energy.

How compact is the device for space-constrained assemblies?


The component occupies a small SMD footprint with a low 1.1mm height, supporting compact board designs while allowing adequate thermal handling when properly mounted.

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