Vishay SI5442DU N-Channel MOSFET, 25 A, 20 V, 8-Pin PowerPAK ChipFET SI5442DU-T1-GE3
- RS 제품 번호:
- 256-7365
- 제조사 부품 번호:
- SI5442DU-T1-GE3
- 제조업체:
- Vishay
대량 구매 할인 기용 가능
View bulk pricing optionsSubtotal (25 units, in packs of 25)*
₩24,050.00
재고있음
- 추가로 2026년 10월 05일 부터 2,675 개 단위 배송
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수량 | 한팩당 | 한팩당* |
|---|---|---|
| 25 - 25 | ₩962.00 | ₩24,040.00 |
| 50 - 75 | ₩912.00 | ₩22,820.00 |
| 100 + | ₩888.00 | ₩22,180.00 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 256-7365
- 제조사 부품 번호:
- SI5442DU-T1-GE3
- 제조업체:
- Vishay
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Vishay | |
| Product Type | MOSFET | |
| Channel Type | N | |
| Maximum Continuous Drain Current Id | 25A | |
| Maximum Drain Source Voltage Vds | 20V | |
| Package Type | PowerPAK ChipFET | |
| Series | SI5442DU | |
| Mount Type | Surface | |
| Pin Count | 8 | |
| Maximum Drain Source Resistance Rds | 0.0135Ω | |
| Maximum Gate Source Voltage Vgs | 8V | |
| Forward Voltage Vf | 1.2V | |
| Typical Gate Charge Qg @ Vgs | 16.6nC | |
| Maximum Power Dissipation Pd | 31W | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | +150°C | |
| Standards/Approvals | RoHS | |
| Height | 850μm | |
| Automotive Standard | No | |
| 모두 선택 | ||
|---|---|---|
브랜드 Vishay | ||
Product Type MOSFET | ||
Channel Type N | ||
Maximum Continuous Drain Current Id 25A | ||
Maximum Drain Source Voltage Vds 20V | ||
Package Type PowerPAK ChipFET | ||
Series SI5442DU | ||
Mount Type Surface | ||
Pin Count 8 | ||
Maximum Drain Source Resistance Rds 0.0135Ω | ||
Maximum Gate Source Voltage Vgs 8V | ||
Forward Voltage Vf 1.2V | ||
Typical Gate Charge Qg @ Vgs 16.6nC | ||
Maximum Power Dissipation Pd 31W | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature +150°C | ||
Standards/Approvals RoHS | ||
Height 850μm | ||
Automotive Standard No | ||
Vishay SI5442DU Series MOSFET, 20V Maximum Drain Source Voltage, 25A Maximum Continuous Drain Current - SI5442DU-T1-GE3
This MOSFET is an N-channel switching transistor designed for high-current power-management roles in compact surface-mounted assemblies. It performs as a low-voltage power device suitable for DC-DC converters and synchronous switching topologies, operating across a wide ambient range for demanding thermal environments.
Features and Benefits:
• Very low on-resistance 0.0135Ω enabling reduced conduction losses
• Continuous drain capability 25A supporting high-current rails
• Drain‑source withstand 20V allowing low-voltage power stages
• Gate tolerance up to 8V permitting flexible drive schemes
• Typical total gate charge 16.6nC for efficient switching control
• Power dissipation 31W enabling sustained thermal loading
• Continuous drain capability 25A supporting high-current rails
• Drain‑source withstand 20V allowing low-voltage power stages
• Gate tolerance up to 8V permitting flexible drive schemes
• Typical total gate charge 16.6nC for efficient switching control
• Power dissipation 31W enabling sustained thermal loading
Applications
• Suitable for synchronous buck converter outputs
• Ideal for automotive‑grade power distribution modules
• Used for high-current load switching in industrial equipment
• Can be used for telecoms power supply stages
• Suitable for point‑of‑load regulation on compact boards
• Ideal for automotive‑grade power distribution modules
• Used for high-current load switching in industrial equipment
• Can be used for telecoms power supply stages
• Suitable for point‑of‑load regulation on compact boards
What thermal range can the device tolerate in deployment?
It is specified to operate from -55°C up to +150°C, accommodating both cold-start and high-temperature operating conditions.
How does the forward voltage affect efficiency in low-voltage systems?
The typical forward voltage of 1.2V across the intrinsic diode reduces dead-time losses and contributes to overall converter efficiency during synchronous operation.
Which package and mounting style are provided for board assembly?
The component is supplied in an 8‑pin PowerPAK ChipFET format intended for surface mounting to enable compact layout and effective thermal pathways.
Is the product compliant with material-restriction directives?
The component meets RoHS requirements, restricting certain hazardous substances in the device composition.
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