Infineon HEXFET Type N-Channel MOSFET, 11 A, 30 V Enhancement, 8-Pin SOIC
- RS 제품 번호:
- 165-8214
- 제조사 부품 번호:
- IRF8707TRPBF
- 제조업체:
- Infineon
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- RS 제품 번호:
- 165-8214
- 제조사 부품 번호:
- IRF8707TRPBF
- 제조업체:
- Infineon
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Infineon | |
| Product Type | MOSFET | |
| Channel Type | Type N | |
| Maximum Continuous Drain Current Id | 11A | |
| Maximum Drain Source Voltage Vds | 30V | |
| Package Type | SOIC | |
| Series | HEXFET | |
| Mount Type | Surface | |
| Pin Count | 8 | |
| Maximum Drain Source Resistance Rds | 17.5mΩ | |
| Channel Mode | Enhancement | |
| Maximum Gate Source Voltage Vgs | 20 V | |
| Forward Voltage Vf | 1V | |
| Maximum Power Dissipation Pd | 2.5W | |
| Typical Gate Charge Qg @ Vgs | 6.2nC | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | 150°C | |
| Standards/Approvals | No | |
| Height | 1.5mm | |
| Width | 4 mm | |
| Length | 5mm | |
| Automotive Standard | AEC-Q101 | |
| 모두 선택 | ||
|---|---|---|
브랜드 Infineon | ||
Product Type MOSFET | ||
Channel Type Type N | ||
Maximum Continuous Drain Current Id 11A | ||
Maximum Drain Source Voltage Vds 30V | ||
Package Type SOIC | ||
Series HEXFET | ||
Mount Type Surface | ||
Pin Count 8 | ||
Maximum Drain Source Resistance Rds 17.5mΩ | ||
Channel Mode Enhancement | ||
Maximum Gate Source Voltage Vgs 20 V | ||
Forward Voltage Vf 1V | ||
Maximum Power Dissipation Pd 2.5W | ||
Typical Gate Charge Qg @ Vgs 6.2nC | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature 150°C | ||
Standards/Approvals No | ||
Height 1.5mm | ||
Width 4 mm | ||
Length 5mm | ||
Automotive Standard AEC-Q101 | ||
Infineon HEXFET Series MOSFET, 11A Maximum Continuous Drain Current, 2.5W Maximum Power Dissipation - IRF8707TRPBF
This MOSFET is tailored for power applications, enhancing efficiency and thermal performance. Its low on-resistance and minimal gate charge significantly reduce both conduction and switching losses, making it well-suited for high-efficiency DC-DC converters across various applications. The Compact SOIC package increases versatility and integrates easily into confined spaces.
Features & Benefits
• Low gate charge diminishes switching losses in applications
• Maximum continuous drain current of 11A boosts performance
• High temperature tolerance up to +150°C ensures reliability
• Low Rds(on) enhances overall power efficiency
• N-channel configuration allows flexible designs
• Fully characterised for avalanche voltage and current provides added security
Applications
• Control of MOSFETs in synchronous buck converters
• Use in isolated DC-DC converters for networking systems
• Power management solutions for notebook processors
• Implementation in automation and control systems for improved performance
What is the suitability for high-temperature environments?
The device operates effectively at temperatures up to +150°C, ensuring reliability in high-heat conditions typical of power applications.
How does this product manage power dissipation?
With a maximum power dissipation of 2.5W, it balances thermal performance, decreasing the risk of overheating.
Can it handle different voltage ratings?
Yes, it can withstand a maximum drain-source voltage of 30V, making it versatile for various applications.
What is the maximum gate threshold voltage?
The maximum gate threshold voltage is 2.35V, ensuring compatibility with a range of drive circuits.
How does the low Rds(on) impact its performance?
The low drain-source on-resistance minimises conduction losses, enhancing efficiency and reducing heat generation during operation.
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