Vishay Isolated TrenchFET 2 Type P-Channel Power MOSFET, 2.3 A, 30 V Enhancement, 6-Pin TSOP

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  • 2026년 10월 27일 부터 배송
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RS 제품 번호:
165-6919
제조사 부품 번호:
SI3993CDV-T1-GE3
제조업체:
Vishay
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모두 선택

브랜드

Vishay

Channel Type

Type P

Product Type

Power MOSFET

Maximum Continuous Drain Current Id

2.3A

Maximum Drain Source Voltage Vds

30V

Series

TrenchFET

Package Type

TSOP

Mount Type

Surface

Pin Count

6

Maximum Drain Source Resistance Rds

188mΩ

Channel Mode

Enhancement

Typical Gate Charge Qg @ Vgs

5.2nC

Minimum Operating Temperature

150°C

Maximum Power Dissipation Pd

1.4W

Maximum Gate Source Voltage Vgs

20V

Maximum Operating Temperature

-55°C

Transistor Configuration

Isolated

Height

1mm

Width

1.7mm

Standards/Approvals

No

Length

3.1mm

Number of Elements per Chip

2

Automotive Standard

No

COO (Country of Origin):
CN

Vishay TrenchFET Series Power MOSFET, 30V Maximum Drain Source Voltage, 2.3A Maximum Continuous Drain Current - SI3993CDV-T1-GE3


This power MOSFET is a surface-mount P-channel switching transistor designed for compact, low-power applications. It operates within a modest voltage range and is intended for efficient switching duties where a dual-element, isolated transistor configuration is required. The component is supplied in a slim TSOP package suited to board-level integration in electronic control systems.

Features and Benefits:


• 30V maximum drain voltage enables safe low-voltage switching
• 2.3A continuous drain current supports moderate load currents
• 188mΩ low RDS(on) reduces conduction losses
• 5.2nC typical gate charge affords fast gate switching
• 1.4W power dissipation allows duty-cycled operation
• Isolated dual-element design enables split-channel implementations

Applications


• Suitable for low-voltage motor control in automation modules
• Ideal for power switching in Compact power supplies
• Used for load switching in embedded control systems
• Can be used for polarity control in battery management circuits

What thermal range can be expected during operation?


The device is rated to operate between -55°C and 150°C, allowing use across extended temperature environments.

How does the package support board assembly?


The TSOP surface-mount format with six pins facilitates automated placement and soldering on densely populated boards.

Can the gate handle higher control voltages?


The gate should not exceed 20V maximum to avoid damaging the gate oxide and to maintain specified performance.

Does the device support multi-element configurations on a single chip?


Yes, it contains two elements per chip in an isolated configuration, enabling paired switching arrangements without external isolation.

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