TDK 22 nF Multilayer Ceramic Capacitor, 50V dc, ±5 %, Surface

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Subtotal (1 pack of 50 units)*

₩9,800.00

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  • 2026년 9월 14일 부터 2,800 개 단위 배송
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한팩당
한팩당*
50 - 450₩196.00₩9,840.00
500 - 950₩192.00₩9,620.00
1000 +₩188.00₩9,420.00

* 참고 가격: 실제 구매가격과 다를 수 있습니다

포장 옵션
RS 제품 번호:
754-6376
제조사 부품 번호:
C2012C0G1H223J125AA
제조업체:
TDK
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브랜드

TDK

Product Type

Multilayer Ceramic Capacitor

Capacitance

22nF

Voltage

50V dc

Package/Case

0805

Mount Type

Surface

Packaging

Embossed Tape

Dielectric

C0G

Tolerance

±5 %

Automotive Standard

No

Termination Type

Surface Mount

Minimum Operating Temperature

-55°C

Series

C

Standards/Approvals

No

Height

1.25mm

Length

2mm

Width

1.25mm

Maximum Operating Temperature

125°C

TDK C Type 0805 Series C0G, X6S, X7R, X7S, X7T, X8R, Y5V Dielectric


TDK C Series of general purpose multilayer ceramic chip capacitors suited for high frequency and high density type power suppliers.

Features and Benefits:


High capacitance through precision technologies that enable the use of multiple thinner ceramic dielectric layers

A monolithic structure ensures superior mechanical strength and reliability

Low ESL and excellent frequency characteristics allow for a circuit design that closely conforms to theoretical values

Low self-heating and high ripple resistance due to low ESR

Applications:


Commercial Grade for general applications including

General electronic equipment; Mobile communication equipment; Power supply circuit; Office automation equipment; TV, LED displays; Servers, PCs, Notebooks, Tablets

0805 Range


Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" Ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are Ideal for decoupling applications.

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