TDK 4.7 μF Multilayer Ceramic Capacitor, 50V dc, ±10 %, Surface
- RS 제품 번호:
- 242-7486
- 제조사 부품 번호:
- CGA4J1X7R1H475K125AE
- 제조업체:
- TDK
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대량 구매 할인 기용 가능
View bulk pricing optionsSubtotal (1 pack of 5 units)*
₩5,080.00
재고있음
- 추가로 2026년 9월 07일 부터 1,330 개 단위 배송
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수량 | 한팩당 | 한팩당* |
|---|---|---|
| 5 - 5 | ₩1,016.00 | ₩5,080.00 |
| 10 - 20 | ₩992.00 | ₩4,960.00 |
| 25 - 45 | ₩972.00 | ₩4,860.00 |
| 50 + | ₩944.00 | ₩4,720.00 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 242-7486
- 제조사 부품 번호:
- CGA4J1X7R1H475K125AE
- 제조업체:
- TDK
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | TDK | |
| Product Type | Multilayer Ceramic Capacitor | |
| Capacitance | 4.7μF | |
| Voltage | 50V dc | |
| Package/Case | 0805 | |
| Construction | Stacked | |
| Mount Type | Surface | |
| Packaging | Tape & Reel | |
| Dielectric | X5R | |
| Tolerance | ±10 % | |
| Automotive Standard | AEC-Q200 | |
| Minimum Operating Temperature | -55°C | |
| Termination Type | Solder | |
| Series | CGA | |
| Standards/Approvals | RoHS, REACH | |
| Height | 1.25mm | |
| Length | 2mm | |
| Width | 1.25mm | |
| Maximum Operating Temperature | 125°C | |
| 모두 선택 | ||
|---|---|---|
브랜드 TDK | ||
Product Type Multilayer Ceramic Capacitor | ||
Capacitance 4.7μF | ||
Voltage 50V dc | ||
Package/Case 0805 | ||
Construction Stacked | ||
Mount Type Surface | ||
Packaging Tape & Reel | ||
Dielectric X5R | ||
Tolerance ±10 % | ||
Automotive Standard AEC-Q200 | ||
Minimum Operating Temperature -55°C | ||
Termination Type Solder | ||
Series CGA | ||
Standards/Approvals RoHS, REACH | ||
Height 1.25mm | ||
Length 2mm | ||
Width 1.25mm | ||
Maximum Operating Temperature 125°C | ||
The TDK soft termination CGA series, automotive grade of TDK's multilayer ceramic chip capacitor, is a product incorporating a conductive resin layer into the terminal electrodes. The resin layer protects the ceramic body from cracks by relieving stress caused by thermal shock and board flexure. It is used in applications such as fail safe design for battery line, prevention of ceramic element crack by board bending, prevention of solder crack by thermal shock, equipment such as mobile devices and smart key having a high possibility of drop.
High resistance to mechanical stress and thermal shock by resin layers
X8R and X8L type whose maximum temperature are up to 150 degree Celsius are available
C0G type having excellent stable temperature and DC-bias characteristics is also available
AEC-Q20
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