TDK 2.2 μF Multilayer Ceramic Capacitor, 100V dc, ±20 %, Surface
- RS 제품 번호:
- 179-5035
- 제조사 부품 번호:
- CGA6N3X7R2A225M230AE
- 제조업체:
- TDK
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현재 액세스할 수 없는 재고 정보
- RS 제품 번호:
- 179-5035
- 제조사 부품 번호:
- CGA6N3X7R2A225M230AE
- 제조업체:
- TDK
사양
참조 문서
제정법과 컴플라이언스
제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | TDK | |
| Capacitance | 2.2μF | |
| Product Type | Multilayer Ceramic Capacitor | |
| Voltage | 100V dc | |
| Package/Case | 1210 | |
| Mount Type | Surface | |
| Packaging | Tape & Reel | |
| Dielectric | X7R | |
| Tolerance | ±20 % | |
| Automotive Standard | AEC-Q200 | |
| Minimum Operating Temperature | -55°C | |
| Termination Type | Surface Mount | |
| Series | CGA | |
| Length | 3.2mm | |
| Width | 2.5mm | |
| Height | 2.3mm | |
| Standards/Approvals | No | |
| Maximum Operating Temperature | 125°C | |
| Suppression Class | Class II | |
| 모두 선택 | ||
|---|---|---|
브랜드 TDK | ||
Capacitance 2.2μF | ||
Product Type Multilayer Ceramic Capacitor | ||
Voltage 100V dc | ||
Package/Case 1210 | ||
Mount Type Surface | ||
Packaging Tape & Reel | ||
Dielectric X7R | ||
Tolerance ±20 % | ||
Automotive Standard AEC-Q200 | ||
Minimum Operating Temperature -55°C | ||
Termination Type Surface Mount | ||
Series CGA | ||
Length 3.2mm | ||
Width 2.5mm | ||
Height 2.3mm | ||
Standards/Approvals No | ||
Maximum Operating Temperature 125°C | ||
Suppression Class Class II | ||
- COO (Country of Origin):
- JP
TDK multilayer ceramic chip capacitor_Soft termination_Automotive grade_CGA series is a product which conductive resin layers are included in terminations. Soft termination series has higher mechanical endurance by the flexible resin layers which absorbs thermal and mechanical stress.
FEATURES
Higher mechanical endurance is realized by flexible resin layers.
X8R type which maximum temperature is up to 150°C is applicable.
C0G temperature characteristic which has excellent stable temperature and DC-bias characteristics is applicable.
APPLICATIONS
Fail-safe design in battery line.
Prevention of ceramic body cracks by board bending.
Prevention of solder cracks by thermal shock.
The set having a high probability of fall such as keyless entry and
Smart-key
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