TDK 2.2 μF Multilayer Ceramic Capacitor, 50V dc, ±10 %, Surface

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Subtotal (1 reel of 2000 units)*

₩396,000.00

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  • 2026년 12월 16일 부터 배송
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2000 - 2000₩198.00₩396,800.00
4000 - 6000₩194.00₩386,800.00
8000 +₩190.00₩380,800.00

* 참고 가격: 실제 구매가격과 다를 수 있습니다

RS 제품 번호:
111-0459
제조사 부품 번호:
C2012X5R1H225K125AB
제조업체:
TDK
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브랜드

TDK

Product Type

Multilayer Ceramic Capacitor

Capacitance

2.2μF

Voltage

50V dc

Package/Case

0805

Packaging

Tape & Reel

Mount Type

Surface

Dielectric

X5R

Tolerance

±10 %

Automotive Standard

No

Termination Type

Surface Mount

Minimum Operating Temperature

-55°C

Series

C

Standards/Approvals

No

Length

2mm

Width

1.25mm

Height

1.25mm

Maximum Operating Temperature

85°C

COO (Country of Origin):
JP

TDK C Type 0805 Series, X5R Dielectric


TDK C Series of general purpose multilayer ceramic chip capacitors suited for high frequency and high density type power suppliers.

Features and Benefits:


High capacitance through precision technologies that enable the use of multiple thinner ceramic dielectric layers

A monolithic structure ensures superior mechanical strength and reliability

Low ESL and excellent frequency characteristics allow for a circuit design that closely conforms to theoretical values

Low self-heating and high ripple resistance due to low ESR

Applications


Commercial Grade for general applications including

General electronic equipment; Mobile communication equipment; Power supply circuit; Office automation equipment; TV, LED displays; Servers, PCs, Notebooks, Tablets

0805 Range


Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" Ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are Ideal for decoupling applications.

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