Microchip SAM9X72-V/4PB-SL3 ARM926EJ-S Microprocessor SAM9X7 32 bit ARM 800 MHz 240-Pin TFBGA
- RS 제품 번호:
- 775-362
- 제조사 부품 번호:
- SAM9X72-V/4PB-SL3
- 제조업체:
- Microchip
N
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Subtotal (1 tray of 176 units)*
₩2,214,326.40
일시적 품절
- 2026년 7월 27일 부터 배송
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수량 | 한팩당 | Per Tray* |
|---|---|---|
| 176 + | ₩12,581.40 | ₩2,214,498.00 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 775-362
- 제조사 부품 번호:
- SAM9X72-V/4PB-SL3
- 제조업체:
- Microchip
사양
참조 문서
제정법과 컴플라이언스
제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Microchip | |
| Series | SAM9X7 | |
| Product Type | Microprocessor | |
| Device Core | ARM926EJ-S | |
| Data Bus Width | 32bit | |
| Instruction Set Architecture | ARM | |
| Maximum Clock Frequency | 800MHz | |
| Interface Type | CAN, I2C, SPI, UART, USB | |
| Mount Type | Surface Mount | |
| Minimum Supply Voltage | 1.15V | |
| Package Type | TFBGA | |
| Pin Count | 240 | |
| Maximum Supply Voltage | 1.25V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | RoHS | |
| Number of Cores | 1 | |
| Automotive Standard | AEC-Q100 | |
| 모두 선택 | ||
|---|---|---|
브랜드 Microchip | ||
Series SAM9X7 | ||
Product Type Microprocessor | ||
Device Core ARM926EJ-S | ||
Data Bus Width 32bit | ||
Instruction Set Architecture ARM | ||
Maximum Clock Frequency 800MHz | ||
Interface Type CAN, I2C, SPI, UART, USB | ||
Mount Type Surface Mount | ||
Minimum Supply Voltage 1.15V | ||
Package Type TFBGA | ||
Pin Count 240 | ||
Maximum Supply Voltage 1.25V | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals RoHS | ||
Number of Cores 1 | ||
Automotive Standard AEC-Q100 | ||
- COO (Country of Origin):
- TW
The Microchip Microprocessor delivers a high-speed ARM926EJ-S core is designed for robust connectivity and Advanced user interfaces. Operating at up to 800 MHz, this versatile MPU provides the reliability needed for industrial applications while offering a wide range of modern memory interfaces to suit your specific hardware design requirements.
11 mm by 11 mm TFBGA package
Extended V-temp temperature range
DDR3 and LPDDR3 memory support
Integrated NAND and eMMC interfaces
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