TE Connectivity 0.5 mm Pitch 260 Way, Right Angle Surface Mount Mount SO DIMM Socket ,25.0 V, 500mA
- RS 제품 번호:
- 185-5879
- 제조사 부품 번호:
- 2309409-1
- 제조업체:
- TE Connectivity
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- RS 제품 번호:
- 185-5879
- 제조사 부품 번호:
- 2309409-1
- 제조업체:
- TE Connectivity
사양
참조 문서
제정법과 컴플라이언스
제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | TE Connectivity | |
| Memory Socket Type | DIMM | |
| Product Type | DIMM Socket | |
| Orientation | Right Angle | |
| Insertion/Removal Method | Cam-In | |
| Current | 500mA | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold Flash, Nickel Plated | |
| Number of Contacts | 260 | |
| Pitch | 0.5mm | |
| Mount Type | Surface Mount | |
| Housing Material | Thermoplastic | |
| SDRAM Type | SO | |
| Minimum Operating Temperature | 85°C | |
| Latching | Yes | |
| Termination Type | Solder | |
| Maximum Operating Temperature | 85°C | |
| Row Spacing | 8.2mm | |
| Maximum Contact Resistance | 50mΩ | |
| Standards/Approvals | RoHS | |
| Series | 2309409 | |
| 모두 선택 | ||
|---|---|---|
브랜드 TE Connectivity | ||
Memory Socket Type DIMM | ||
Product Type DIMM Socket | ||
Orientation Right Angle | ||
Insertion/Removal Method Cam-In | ||
Current 500mA | ||
Contact Material Copper Alloy | ||
Contact Plating Gold Flash, Nickel Plated | ||
Number of Contacts 260 | ||
Pitch 0.5mm | ||
Mount Type Surface Mount | ||
Housing Material Thermoplastic | ||
SDRAM Type SO | ||
Minimum Operating Temperature 85°C | ||
Latching Yes | ||
Termination Type Solder | ||
Maximum Operating Temperature 85°C | ||
Row Spacing 8.2mm | ||
Maximum Contact Resistance 50mΩ | ||
Standards/Approvals RoHS | ||
Series 2309409 | ||
TE Connectivity’s (TE) main memory connectors are made to JEDEC industry standards for dual in-line memory modules (DIMM) and small outline DIMM (SO DIMM) as well as custom memory modules for server, workstation, desktop, notebook, storage and communication applications. Our memory socket portfolio covers the DDR2, DDR3, and DDR4 generations of sockets. Each product family consists of vertical and a few right-angle and various-angled configurations in solder tail and surface mount (SMT) mounting options.
Designed to JEDEC industry standards for new and existing DIMM memory modules
Provide end latches for module retention, ejection and mechanical voltage keying
SO DIMM sockets are offered in several stacking heights to maximize board space
Applications
Servers
High Performance Computing (HPC)
Workstations
Mass storages
Communication equipment
Desktop PCs
Instrument equipment
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