OIS-330-770-X-TU EPIGAP OSA Photonics OIS-330 770 nm IR LED 1206 Surface Mount package
- RS 제품 번호:
- 173-6324
- 제조사 부품 번호:
- OIS-330-770-X-TU
- 제조업체:
- EPIGAP OSA Photonics
본 이미지는 참조용이오니 재확인이 필요하시면 문의해주세요.
대량 구매 할인 기용 가능
Subtotal (1 pack of 10 units)*
₩24,355.50
재고있음
- 80 개 단위 배송 준비 완료
- 추가로 2026년 6월 03일 부터 40 개 단위 배송
- 추가로 2026년 7월 03일 부터 500 개 단위 배송
더 자세한 내용이 필요하신가요? 필요한 수량을 입력하고 '배송일 확인'을 클릭하면 더 많은 재고 및 배송 세부정보를 확인하실 수 있습니다.
수량 | 한팩당 | 한팩당* |
|---|---|---|
| 10 - 120 | ₩2,435.55 | ₩24,355.50 |
| 130 - 240 | ₩2,382.90 | ₩23,829.00 |
| 250 + | ₩2,332.20 | ₩23,322.00 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 173-6324
- 제조사 부품 번호:
- OIS-330-770-X-TU
- 제조업체:
- EPIGAP OSA Photonics
사양
참조 문서
제정법과 컴플라이언스
제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | EPIGAP OSA Photonics | |
| Product Type | IR LED | |
| Peak Wavelength | 770nm | |
| Package Type | 1206 | |
| Radiant Intensity | 7.1mW/sr | |
| Packaging | Tape | |
| Mount Type | Surface Mount | |
| Number of LEDs | 1 | |
| Number of Pins | 2 | |
| Lens Shape | Dome | |
| Series | OIS-330 | |
| LED Material | GaP, InGaN, GaAlAs, AlInGaP | |
| Standards/Approvals | No | |
| Maximum Supply Voltage | 2V | |
| Automotive Standard | No | |
| 모두 선택 | ||
|---|---|---|
브랜드 EPIGAP OSA Photonics | ||
Product Type IR LED | ||
Peak Wavelength 770nm | ||
Package Type 1206 | ||
Radiant Intensity 7.1mW/sr | ||
Packaging Tape | ||
Mount Type Surface Mount | ||
Number of LEDs 1 | ||
Number of Pins 2 | ||
Lens Shape Dome | ||
Series OIS-330 | ||
LED Material GaP, InGaN, GaAlAs, AlInGaP | ||
Standards/Approvals No | ||
Maximum Supply Voltage 2V | ||
Automotive Standard No | ||
We develop and manufacture special, custom designed and standard High Brightness & High Power LED-Chips , SMD-LEDs and LED-Lamps in the colors white, uv 265-420nm ,vis 420-660nm and ir 660-1650nm. Our custom designed LED-Modules for OEMs are an efficient way for luminaries and other lighting applications.
package: 1206
size: 3.2mm x 1.6mm x 1.9mm
view angle: 40°
with lens
technology: GaP, AlInGaP, GaAlAs and InGaN
soldering pads: gold plated
through hole mountable
suitable for all SMT assembly methods
with lens, mounting from backside of PCB
View angle 40°
package: 1206
size: 3.2mm x 1.6mm x 1.9mm
circuit substrate: glass laminated epoxy
Lead free solderable, soldering pads:gold plated
taped in 8 mm blister tape, cathode to transporting perforation
all devices sorted into luminous intensity classes
taping: face-up(TU) or face-down(TD) possible
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