OIS-150-IT855-X-T EPIGAP OSA Photonics, OIS-150 855nm IR LED, 1206 SMD package
- RS 제품 번호:
- 173-6298
- 제조사 부품 번호:
- OIS-150-IT855-X-T
- 제조업체:
- EPIGAP OSA Photonics
대량 구매 할인 기용 가능
Subtotal (1 pack of 10 units)*
₩25,737.20
재고있음
- 580 개 단위 배송 준비 완료
더 자세한 내용이 필요하신가요? 필요한 수량을 입력하고 '배송일 확인'을 클릭하면 더 많은 재고 및 배송 세부정보를 확인하실 수 있습니다.
수량 | 한팩당 | 한팩당* |
|---|---|---|
| 10 - 120 | ₩2,573.72 | ₩25,737.20 |
| 130 - 240 | ₩2,515.44 | ₩25,154.40 |
| 250 + | ₩2,462.80 | ₩24,628.00 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 173-6298
- 제조사 부품 번호:
- OIS-150-IT855-X-T
- 제조업체:
- EPIGAP OSA Photonics
사양
참조 문서
제정법과 컴플라이언스
제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | EPIGAP OSA Photonics | |
| Peak Wavelength | 855nm | |
| Package Type | 1206 | |
| Mounting Type | Surface Mount | |
| Number of LEDs | 1 | |
| Number of Pins | 2 | |
| Dimensions | 3.2 x 1.6 x 1.2mm | |
| Lens Shape | Square | |
| Series | OIS-150 | |
| LED Material | AlInGaP, GaAlAs, GaP, InGaN | |
| 모두 선택 | ||
|---|---|---|
브랜드 EPIGAP OSA Photonics | ||
Peak Wavelength 855nm | ||
Package Type 1206 | ||
Mounting Type Surface Mount | ||
Number of LEDs 1 | ||
Number of Pins 2 | ||
Dimensions 3.2 x 1.6 x 1.2mm | ||
Lens Shape Square | ||
Series OIS-150 | ||
LED Material AlInGaP, GaAlAs, GaP, InGaN | ||
We develop and manufacture special, custom designed and standard High Brightness & High Power LED-Chips , SMD-LEDs and LED-Lamps in the colors white, uv 265-420nm ,vis 420-660nm and ir 660-1650nm. Our custom designed LED-Modules for OEMs are an efficient way for luminaries and other lighting applications.
package: 1206
size: 3.2mm x 1.6mm x 1.2mm
view angle: 140°
technology: GaP, AlInGaP, GaAlAs and InGaN
(un)colored, (un)diffused encapsulation available
soldering pads: gold plated
suitable for all SMT assembly methods
size: 3.2mm x 1.6mm x 1.2mm
view angle: 140°
technology: GaP, AlInGaP, GaAlAs and InGaN
(un)colored, (un)diffused encapsulation available
soldering pads: gold plated
suitable for all SMT assembly methods
View angle 40°
package: 1206
size: 3.2mm x 1.6mm x 1.2mm
circuit substrate: glass laminated epoxy
Lead free solderable, soldering pads:gold plated
taped in 8 mm blister tape, cathode to transporting perforation
all devices sorted into luminous intensity classes
taping: face-up(TU) or face-down(TD) possible
package: 1206
size: 3.2mm x 1.6mm x 1.2mm
circuit substrate: glass laminated epoxy
Lead free solderable, soldering pads:gold plated
taped in 8 mm blister tape, cathode to transporting perforation
all devices sorted into luminous intensity classes
taping: face-up(TU) or face-down(TD) possible
For these non-cancellable (NC), and non-returnable (NR) products, Terms and Conditions apply.
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