Winslow Straight Through Hole Mount 2.54 mm Pitch IC Socket Adapter, QFP to PGA
- RS 재고 번호:
- 295-4347
- 제조 부품 번호:
- WA20850PRC
- 제조업체:
- Winslow
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Subtotal (1 unit)*
₩87,478.28
일시적 품절
- 2026년 4월 03일 부터 배송
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단위당 | 한팩당 |
|---|---|
| 1 - 24 | ₩87,478.28 |
| 25 - 99 | ₩84,415.76 |
| 100 + | ₩80,480.92 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 재고 번호:
- 295-4347
- 제조 부품 번호:
- WA20850PRC
- 제조업체:
- Winslow
사양
제정법과 컴플라이언스
제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Winslow | |
| Product Type | IC Socket Adapter | |
| Connection A | QFP | |
| Number of Contacts A | 208 | |
| Connection Gender A | Female | |
| Connection Gender B | Female | |
| Number of Contacts B | 208 | |
| Contact Plating | Gold, Tin | |
| Connection B | PGA | |
| Pitch | 2.54mm | |
| Mount Type | Through Hole | |
| Orientation | Straight | |
| Standards/Approvals | No | |
| Contact Material | Beryllium Copper Alloy | |
| Housing Material | Polyphenylene Sulphide | |
| 모두 선택 | ||
|---|---|---|
브랜드 Winslow | ||
Product Type IC Socket Adapter | ||
Connection A QFP | ||
Number of Contacts A 208 | ||
Connection Gender A Female | ||
Connection Gender B Female | ||
Number of Contacts B 208 | ||
Contact Plating Gold, Tin | ||
Connection B PGA | ||
Pitch 2.54mm | ||
Mount Type Through Hole | ||
Orientation Straight | ||
Standards/Approvals No | ||
Contact Material Beryllium Copper Alloy | ||
Housing Material Polyphenylene Sulphide | ||
- COO (Country of Origin):
- GB
QFP to PGA Two Piece Adaptors
QFP adaptors which convert a broad range of QFP ICs into a PGA footprint. The adaptors are supplied in 2 pieces, the adaptor and its mating PGA socket.
QFP Adaptor Body material is Epoxy Fibreglass FR4; Contact material is Brass; Tin over Nickel plating
PGA Socket Body material is Polyphenylene sulphide (PPS); Contact material is Beryllium Copper; Gold inner contact plating with Tin outer sleeve
IC Sockets-Package Adaptics
A range of ’Adaptics’ which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
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