RS PRO Heatsink, Universal Rectangular Alu, 22K/W, 23 x 23 x 6mm, Adhesive Foil

대량 구매 할인 기용 가능

Subtotal (1 Bag of 5 units)*

₩17,014.00

Add to Basket
수량 선택 또는 입력
재고있음
  • 42 개 단위 배송 준비 완료
  • 추가로 2026년 3월 05일 부터 111 개 단위 배송
더 자세한 내용이 필요하신가요? 필요한 수량을 입력하고 '배송일 확인'을 클릭하면 더 많은 재고 및 배송 세부정보를 확인하실 수 있습니다.
Bag(s)
Per Bag
한팩당*
1 - 99₩17,014.00₩3,402.80
100 - 249₩16,976.40₩3,395.28
250 - 499₩16,957.60₩3,391.52
500 +₩16,920.00₩3,384.00

* 참고 가격: 실제 구매가격과 다를 수 있습니다

RS 제품 번호:
750-0894
Distrelec 제품 번호:
304-04-855
제조업체:
RS PRO
제품 정보를 선택해 유사 제품을 찾기
모두 선택

브랜드

RS PRO

For Use With

Universal Rectangular Alu

Length

23mm

Width

23mm

Height

6mm

Dimensions

23 x 23 x 6mm

Thermal Resistance

22K/W

Mounting

Adhesive Foil

Colour

Black

Application

Semiconductor Devices

Material

Aluminium

Package Type

BGA

Finish

Anodized

COO (Country of Origin):
GB

BGA Heatsink, Standard


Standard type BGA heatsink suitable for a variety of applications.

RS PRO Heatsink - Adhesive Foil, 23 mm x 23 mm x 6 mm


The RS PRO standard BGA (Ball Grid Array) Push Pin heatsink is meticulously designed for superior performance and precision, seamlessly integrating into your electronic systems. This heatsink serves as a crucial element in preventing circuits from overheating, thereby ensuring the consistent and reliable performance of your electronic devices.

Crafted from aluminium with a durable anodized finish, this heatsink offers excellent heat dissipation capabilities. Its secure mounting, facilitated by adhesive foil, provides a stable and efficient connection to electronic components.

Why Would You Choose This Heatsink?


The RS PRO Heatsink plays a vital role in maintaining optimal operating temperatures for your electronic components, safeguarding them against the risks of overheating. As electronic components generate heat during operation, the heatsink effectively absorbs and dissipates this heat, preventing the accumulation that could otherwise lead to damage or a decline in component performance. Invest in the RS PRO Heatsink for enhanced thermal management and prolonged durability of your electronic devices.

Features and Benefits


  • BGA heatsink

  • Standard, Pushpin

  • Made from aluminium

  • Adhesive foil mounting

  • Anodized finish

  • For use with Universal rectangular Alu

  • Thermal resistance 22.0° C/W

Dimensions


  • 23 mm x 23 mm x 6mm

Applications


  • Integrated Circuits

  • PCB


BGA Heatsinks

관련된 링크들