Fischer Elektronik Heatsink, Universal Rectangular Alu with Fan 83 mm 150 mm 80 mm
- RS 제품 번호:
- 692-0626
- 제조사 부품 번호:
- LA 9 150 24 V
- 제조업체:
- Fischer Elektronik
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Subtotal (1 unit)*
₩366,205.20
- 11 개 단위 배송 준비 완료
- 추가로 2026년 3월 09일 부터 3 개 단위 배송
- 추가로 2026년 6월 08일 부터 4 개 단위 배송
수량 | 한팩당 |
|---|---|
| 1 - 99 | ₩366,205.20 |
| 100 - 249 | ₩351,560.00 |
| 250 - 499 | ₩346,296.00 |
| 500 + | ₩342,404.40 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 692-0626
- 제조사 부품 번호:
- LA 9 150 24 V
- 제조업체:
- Fischer Elektronik
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Fischer Elektronik | |
| For Use With | Universal Rectangular Alu with Fan | |
| Product Type | Heatsink | |
| Length | 150mm | |
| Width | 80 mm | |
| Height | 83mm | |
| Finish | Black Anodised | |
| Standards/Approvals | No | |
| Application | Cooling | |
| Material | Aluminium | |
| Special Features | Technical Introduction, Maximum Heat Flow Due to Brazing or Thermal Adhesion, Two Opposite Mounting Surfaces Are Milled Flat, Geometry of Hollow Fin Optimizing the Air Flow, Cooling Aggreg in Segment Mount, Additional Treatment Upon Customer's Request, Particularly Effective Heat Dissipation, High Performance Density Due to Large Heatconducting Surfaces, Standard Aluminium Profiles, Special Heatsink Design, Miniature Cooling Aggregates, Compact Construction, Mounting Pads, Protection Grid for Axial Fans, With Air Flow Chamber, Silicone Wafers, Extremely Low Losses Due to Optimised Hollow Fin Geometry, Thermal Conductive Silicone Foam Foil, Heatsinks With Hollow Fin Profile, Cooling Aggregates With Radial Fan, High Performance Cooling Aggregates, Semiconductor Mounting Surface for Milled Flat, Heatsinks for Solid State Relay, Hole Pattern, Cooling Aggregates With Axial Fan | |
| 모두 선택 | ||
|---|---|---|
브랜드 Fischer Elektronik | ||
For Use With Universal Rectangular Alu with Fan | ||
Product Type Heatsink | ||
Length 150mm | ||
Width 80 mm | ||
Height 83mm | ||
Finish Black Anodised | ||
Standards/Approvals No | ||
Application Cooling | ||
Material Aluminium | ||
Special Features Technical Introduction, Maximum Heat Flow Due to Brazing or Thermal Adhesion, Two Opposite Mounting Surfaces Are Milled Flat, Geometry of Hollow Fin Optimizing the Air Flow, Cooling Aggreg in Segment Mount, Additional Treatment Upon Customer's Request, Particularly Effective Heat Dissipation, High Performance Density Due to Large Heatconducting Surfaces, Standard Aluminium Profiles, Special Heatsink Design, Miniature Cooling Aggregates, Compact Construction, Mounting Pads, Protection Grid for Axial Fans, With Air Flow Chamber, Silicone Wafers, Extremely Low Losses Due to Optimised Hollow Fin Geometry, Thermal Conductive Silicone Foam Foil, Heatsinks With Hollow Fin Profile, Cooling Aggregates With Radial Fan, High Performance Cooling Aggregates, Semiconductor Mounting Surface for Milled Flat, Heatsinks for Solid State Relay, Hole Pattern, Cooling Aggregates With Axial Fan | ||
- COO (Country of Origin):
- HU
Fischer Elektronik Cooling Aggregates with Axial Fans
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