Fischer Elektronik Heatsink, Universal Round Alu, 5.6°C/W 20 mm
- RS 제품 번호:
- 674-4844
- 제조사 부품 번호:
- ICK S R 32,5x20
- 제조업체:
- Fischer Elektronik
Subtotal (1 unit)*
₩18,472.88
- 60 개 단위 배송 준비 완료
수량 | 한팩당 |
|---|---|
| 1 - 49 | ₩18,472.88 |
| 50 - 99 | ₩17,734.04 |
| 100 - 249 | ₩16,998.96 |
| 250 + | ₩16,630.48 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 674-4844
- 제조사 부품 번호:
- ICK S R 32,5x20
- 제조업체:
- Fischer Elektronik
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Fischer Elektronik | |
| Product Type | Heatsink | |
| For Use With | Universal Round Alu | |
| Height | 20mm | |
| Fastening | Conductive Foil | |
| Thermal Resistance | 5.6°C/W | |
| Diameter | 32.5 mm | |
| Finish | Black Anodised | |
| Compatible Package Type | LED, PGA, PLCC, BGA, SMD, IC, DIL/IC, Chip, Slot | |
| Standards/Approvals | No | |
| Application | PLCC, Power PC, PGA, Bga, Microprocessor, Fan, Heat Sink For IC, Cooler, Ic Processors, SMD | |
| Material | Aluminium | |
| Special Features | Compact Design With High Mechanical Stability, Customer Specific Modifications and Special Designs, Excellent Thermal Efficiency, Other Operating Voltages on Request, High Mechanical Stability, Effective Heat Dissipation, Fan Motors With Pulse Output and Alarm Device Circuit, Flow-favourable Omnidirectional Fin Geometry, Other Pin Lengths and Surfaces on Request, Components Fastened Using Glue Adhesive Foil or Clamps, High-grade Industrial Type, Particularly Suited for Ball Grid Arrays, Low Current Consumption, Can Be Glued Directly on BGA Component, Low Weight by Optimised Geometry, Heat Sink Dimensions Match Respective BGA Type, Fan Motor Axle With Double Ball Bearings | |
| 모두 선택 | ||
|---|---|---|
브랜드 Fischer Elektronik | ||
Product Type Heatsink | ||
For Use With Universal Round Alu | ||
Height 20mm | ||
Fastening Conductive Foil | ||
Thermal Resistance 5.6°C/W | ||
Diameter 32.5 mm | ||
Finish Black Anodised | ||
Compatible Package Type LED, PGA, PLCC, BGA, SMD, IC, DIL/IC, Chip, Slot | ||
Standards/Approvals No | ||
Application PLCC, Power PC, PGA, Bga, Microprocessor, Fan, Heat Sink For IC, Cooler, Ic Processors, SMD | ||
Material Aluminium | ||
Special Features Compact Design With High Mechanical Stability, Customer Specific Modifications and Special Designs, Excellent Thermal Efficiency, Other Operating Voltages on Request, High Mechanical Stability, Effective Heat Dissipation, Fan Motors With Pulse Output and Alarm Device Circuit, Flow-favourable Omnidirectional Fin Geometry, Other Pin Lengths and Surfaces on Request, Components Fastened Using Glue Adhesive Foil or Clamps, High-grade Industrial Type, Particularly Suited for Ball Grid Arrays, Low Current Consumption, Can Be Glued Directly on BGA Component, Low Weight by Optimised Geometry, Heat Sink Dimensions Match Respective BGA Type, Fan Motor Axle With Double Ball Bearings | ||
- COO (Country of Origin):
- DE
ICK S R Series
PGA Heatsinks
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