Fischer Elektronik Heatsink, Universal Square Alu 14 mm 14 mm 14 mm
- RS 제품 번호:
- 674-4740
- 제조사 부품 번호:
- ICK PGA 6x6x14
- 제조업체:
- Fischer Elektronik
Subtotal (1 unit)*
₩3,684.80
- 285 개 단위 배송 준비 완료
수량 | 한팩당 |
|---|---|
| 1 - 49 | ₩3,684.80 |
| 50 - 99 | ₩3,628.40 |
| 100 - 249 | ₩3,515.60 |
| 250 + | ₩3,384.00 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 674-4740
- 제조사 부품 번호:
- ICK PGA 6x6x14
- 제조업체:
- Fischer Elektronik
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Fischer Elektronik | |
| For Use With | Universal Square Alu | |
| Product Type | Heatsink | |
| Length | 14mm | |
| Width | 14 mm | |
| Height | 14mm | |
| Fastening | Conductive Foil | |
| Colour | Black | |
| Finish | Black Anodised | |
| Compatible Package Type | IC, BGA, LED, Slot, SMD, PGA | |
| Standards/Approvals | No | |
| Application | Heat Sink For Bga, Cooler, SMD, Fan, PGA, Microprocessor, Pentium, Semiconductor | |
| Material | Aluminium | |
| Special Features | Fan Motors Also Available With Other Operating Voltages and Pulse Output/alarm Device Circuit, Particularly Suited for Ball Grid Arrays, High Mechanical Stability, Long Product Life, Optimised Geometry for Low Weight, Other Pin Lengths and Surfaces on Request, Can Be Glued Directly on BGA Component, Heat Sink Dimensions Match Respective BGA Type, Effective Heat Dissipation, Custom Modifications and Special Designs, Excellent Thermal Conductivity, Low Current Consumption, High Reliability | |
| 모두 선택 | ||
|---|---|---|
브랜드 Fischer Elektronik | ||
For Use With Universal Square Alu | ||
Product Type Heatsink | ||
Length 14mm | ||
Width 14 mm | ||
Height 14mm | ||
Fastening Conductive Foil | ||
Colour Black | ||
Finish Black Anodised | ||
Compatible Package Type IC, BGA, LED, Slot, SMD, PGA | ||
Standards/Approvals No | ||
Application Heat Sink For Bga, Cooler, SMD, Fan, PGA, Microprocessor, Pentium, Semiconductor | ||
Material Aluminium | ||
Special Features Fan Motors Also Available With Other Operating Voltages and Pulse Output/alarm Device Circuit, Particularly Suited for Ball Grid Arrays, High Mechanical Stability, Long Product Life, Optimised Geometry for Low Weight, Other Pin Lengths and Surfaces on Request, Can Be Glued Directly on BGA Component, Heat Sink Dimensions Match Respective BGA Type, Effective Heat Dissipation, Custom Modifications and Special Designs, Excellent Thermal Conductivity, Low Current Consumption, High Reliability | ||
- COO (Country of Origin):
- DE
ICK PGA Series
PGA Heatsinks
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