Transcend TS1TMTE370T 2230-S3-M 1 TB Internal SSD
- RS 제품 번호:
- 175-421
- 제조사 부품 번호:
- TS1TMTE370T
- 제조업체:
- Transcend
공급 부족
글로벌 공급 부족으로 인해 언제 재입고될지 모릅니다.
- RS 제품 번호:
- 175-421
- 제조사 부품 번호:
- TS1TMTE370T
- 제조업체:
- Transcend
사양
참조 문서
제정법과 컴플라이언스
제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Transcend | |
| Memory Size | 1TB | |
| Sub Type | SSD | |
| Model Number | TS1TMTE370T | |
| Product Type | SSD | |
| Internal/External | Internal | |
| Industrial Grade | Yes | |
| Form Factor | 2230-S3-M | |
| NAND Type | 3D TLC | |
| Encryption Level | AES | |
| Interface Type | PCIe Gen 3.0 x4 NVMe | |
| Minimum Operating Temperature | -20°C | |
| Maximum Operating Temperature | 75°C | |
| Height | 2.38mm | |
| Length | 30mm | |
| Standards/Approvals | BSMI, CE, FCC, RoHS, UKCA | |
| Width | 22mm | |
| 모두 선택 | ||
|---|---|---|
브랜드 Transcend | ||
Memory Size 1TB | ||
Sub Type SSD | ||
Model Number TS1TMTE370T | ||
Product Type SSD | ||
Internal/External Internal | ||
Industrial Grade Yes | ||
Form Factor 2230-S3-M | ||
NAND Type 3D TLC | ||
Encryption Level AES | ||
Interface Type PCIe Gen 3.0 x4 NVMe | ||
Minimum Operating Temperature -20°C | ||
Maximum Operating Temperature 75°C | ||
Height 2.38mm | ||
Length 30mm | ||
Standards/Approvals BSMI, CE, FCC, RoHS, UKCA | ||
Width 22mm | ||
- COO (Country of Origin):
- TW
Transcend SSD, 1TB Memory Size, PCIe Gen 3.0 x4 NVMe Interface Type - TS1TMTE370T
This SSD is an internal NVMe storage device designed for embedded and industrial environments, delivering high-capacity solid-state storage over a PCIe Gen3 x4 link. It operates across a broad temperature range and implements hardware-level encryption to protect stored data while fitting Compact system designs.
Features and Benefits:
• 1TB capacity provides large local data storage
• PCIe Gen3 x4 Interface enables high-throughput transfers
• 3D TLC NAND offers balanced endurance and density
• AES hardware encryption secures stored information
• Industrial-grade design supports prolonged field use
• Conforms to RoHS, CE, FCC and UKCA regulatory standards
• PCIe Gen3 x4 Interface enables high-throughput transfers
• 3D TLC NAND offers balanced endurance and density
• AES hardware encryption secures stored information
• Industrial-grade design supports prolonged field use
• Conforms to RoHS, CE, FCC and UKCA regulatory standards
Applications
• Suitable for industrial embedded controllers requiring local storage
• Ideal for IoT gateways with limited internal space
• Used with automotive and transport data-logging systems
• Can be used for edge compute nodes in harsh climates
• Useful for secure on-device data retention in appliances
• Ideal for IoT gateways with limited internal space
• Used with automotive and transport data-logging systems
• Can be used for edge compute nodes in harsh climates
• Useful for secure on-device data retention in appliances
What temperature extremes can it tolerate in operation?
It functions across an operating range from -20°C to 75°C, supporting deployment in hot and cold environments.
What form factor is required for installation in Compact systems?
The drive uses the 2230-S3-M form factor, compatible with systems accepting 2230 M.2 modules.
Which NAND technology does the device use and why does that matter?
It employs 3D TLC memory, which provides a balance between storage density and write endurance suited to many industrial workloads.
What connectivity standard must a host support for full performance?
The host must provide a PCIe Gen3 x4 NVMe Interface to achieve the intended data throughput.
Which certifications indicate suitability for regulated markets?
The unit holds BSMI, CE, FCC and RoHS approvals along with UKCA marking for applicable jurisdictions.
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