Infineon 1ED3122MC12HXUMA1 MOSFET Gate Driver 2, 9 A 8-Pin 17V, DSO
- RS 제품 번호:
- 233-3473
- 제조사 부품 번호:
- 1ED3122MC12HXUMA1
- 제조업체:
- Infineon
대량 구매 할인 기용 가능
View bulk pricing optionsSubtotal (1 pack of 2 units)*
₩10,680.00
재고있음
- 304 개 단위 배송 준비 완료
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수량 | 한팩당 | 한팩당* |
|---|---|---|
| 2 - 8 | ₩5,340.00 | ₩10,680.00 |
| 10 - 98 | ₩5,230.00 | ₩10,460.00 |
| 100 - 248 | ₩5,130.00 | ₩10,260.00 |
| 250 - 498 | ₩5,020.00 | ₩10,040.00 |
| 500 + | ₩4,920.00 | ₩9,840.00 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 233-3473
- 제조사 부품 번호:
- 1ED3122MC12HXUMA1
- 제조업체:
- Infineon
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Infineon | |
| Product Type | Gate Driver | |
| Output Current | 9A | |
| Pin Count | 8 | |
| Package Type | DSO | |
| Fall Time | 30ns | |
| Driver Type | MOSFET | |
| Number of Outputs | 2 | |
| Rise Time | 30ns | |
| Minimum Supply Voltage | 3.1V | |
| Maximum Supply Voltage | 17V | |
| Number of Drivers | 2 | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 125°C | |
| Height | 2.65mm | |
| Length | 7.5mm | |
| Series | 1ED3122MC12H | |
| Width | 6.4mm | |
| Standards/Approvals | No | |
| Mount Type | Surface | |
| Automotive Standard | No | |
| 모두 선택 | ||
|---|---|---|
브랜드 Infineon | ||
Product Type Gate Driver | ||
Output Current 9A | ||
Pin Count 8 | ||
Package Type DSO | ||
Fall Time 30ns | ||
Driver Type MOSFET | ||
Number of Outputs 2 | ||
Rise Time 30ns | ||
Minimum Supply Voltage 3.1V | ||
Maximum Supply Voltage 17V | ||
Number of Drivers 2 | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 125°C | ||
Height 2.65mm | ||
Length 7.5mm | ||
Series 1ED3122MC12H | ||
Width 6.4mm | ||
Standards/Approvals No | ||
Mount Type Surface | ||
Automotive Standard No | ||
Infineon 1ED3122MC12H Series Gate Driver, 9A Output Current, 3.1V Minimum Supply Voltage - 1ED3122MC12HXUMA1
This gate driver is a dual-channel MOSFET driver designed to translate logic-level control into high-current outputs for switching applications. It operates across a low-to-moderate supply range and is supplied in a surface-mount DSO package suited to Compact electronic assemblies. The device is intended for environments requiring controlled switching speed and reliable thermal endurance within an extended operating temperature range.
Features and Benefits:
• 9A output current provides strong drive for power MOSFET Gates
• 3.1V minimum supply enables operation from low-voltage logic rails
• 17V maximum supply supports diverse gate voltage requirements
• 30ns rise and fall times reduce switching losses and distortion
• Dual outputs allow independent or complementary gate control
• 8-pin surface-mount package facilitates automated PCB assembly
• 3.1V minimum supply enables operation from low-voltage logic rails
• 17V maximum supply supports diverse gate voltage requirements
• 30ns rise and fall times reduce switching losses and distortion
• Dual outputs allow independent or complementary gate control
• 8-pin surface-mount package facilitates automated PCB assembly
Applications
• Suitable for motor drive gate stage implementations
• Ideal for DC-DC converter MOSFET drive circuits
• Used with half-bridge and full-bridge power stages
• Can be used for industrial switching modules operating across a wide temperature range
• Used for Compact power electronics where board space is limited
• Ideal for DC-DC converter MOSFET drive circuits
• Used with half-bridge and full-bridge power stages
• Can be used for industrial switching modules operating across a wide temperature range
• Used for Compact power electronics where board space is limited
What thermal range can handle harsh operating conditions?
It is rated to function between -40°C and 125°C, providing extended thermal capability.
Which package dimensions affect PCB land pattern design?
The component is supplied in a DSO package with a width of 6.4 mm, length of 7.5 mm and a height of 2.65 mm.
How many gate outputs are available for topology flexibility?
The device contains two outputs enabling dual-channel gate driving arrangements.
What mounting method is required for assembly?
It is intended for surface mounting on printed circuit assemblies.
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