Infineon IR2214SSTRPBF MOSFET Gate Driver, 2 A 24-Pin 20V, SSOP

본 이미지는 참조용이오니 재확인이 필요하시면 문의해주세요.

대량 구매 할인 기용 가능
View bulk pricing options

Subtotal (2000 units, on reels of 2000)*

₩15,856,000.00

Add to Basket
수량 선택 또는 입력
일시적 품절
  • 2027년 6월 30일 부터 배송
더 자세한 내용이 필요하신가요? 필요한 수량을 입력하고 '배송일 확인'을 클릭하면 더 많은 재고 및 배송 세부정보를 확인하실 수 있습니다.

수량
한팩당
릴당*
2000 - 8000₩7,928.00₩15,854,800.00
10000 +₩7,690.00₩15,379,200.00

* 참고 가격: 실제 구매가격과 다를 수 있습니다

RS 제품 번호:
226-6160
제조사 부품 번호:
IR2214SSTRPBF
제조업체:
Infineon
제품 정보를 선택해 유사 제품을 찾기
모두 선택

브랜드

Infineon

Product Type

Gate Driver

Output Current

2A

Pin Count

24

Fall Time

7ns

Package Type

SSOP

Number of Outputs

4

Driver Type

MOSFET

Rise Time

24ns

Minimum Supply Voltage

11.5V

Maximum Supply Voltage

20V

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

125°C

Height

2mm

Length

8.5mm

Standards/Approvals

No

Width

5.6mm

Series

IR2214

Mount Type

Surface

Automotive Standard

No

Infineon IR2214 Series Gate Driver, 11.5V Minimum Supply Voltage, 2A Output Current - IR2214SSTRPBF


This gate driver is a surface-mount MOSFET driver IC designed to Interface low-voltage control logic with power switches in electronic systems. It operates from a low supply threshold and supports multi-output driving for Compact power stages, functioning across a wide ambient temperature range for demanding environments.

Features and Benefits:


• Operates from 11.5V allowing low-voltage system compatibility
• Supports up to 20V supply for increased gate-drive amplitude
• Four outputs enabling multi-channel switching control
• 2A output current for effective gate charge delivery
• Fast fall time of 7ns to reduce switching losses
• Rise time of 24ns aiding predictable switching behaviour

Applications


• Suitable for multi-phase power conversion stages
• Ideal for driving MOSFET banks in motor controllers
• Used with synchronous buck converters for gate control
• Can be used for Compact surface-mount power modules
• Used for temperature-stable switching in harsh environments

What package type should I plan for in PCB layout?


It is supplied in an SSOP package with 24 pins, so design pad and solder mask clearances to suit a 24-pin SSOP footprint.

What environmental limits must be considered for thermal design?


The device is rated to operate between -40°C and 125°C, so thermal management should account for maximum ambient and power dissipation at 125°C.

How many switching channels are available for parallel or independent control?


There are four independent outputs, permitting either parallel drive configurations or separate channel control.

What mounting method is required for assembly?


The component is intended for surface mounting, so standard SMD reflow processes are appropriate.

관련된 링크들