Lattice FPGA iCE40LP1K-CM49 iCE40 LP/HX 1280 Cells, 64 kB 160 Blocks, 49-Pin UCBGA
- RS 제품 번호:
- 772-0085
- 제조사 부품 번호:
- iCE40LP1K-CM49
- 제조업체:
- Lattice Semiconductor
본 이미지는 참조용이오니 재확인이 필요하시면 문의해주세요.
Subtotal (1 unit)*
₩9,136.80
마지막 RS 재고
- 최종적인 63 개 unit(s)이 배송 준비 됨
수량 | 한팩당 |
|---|---|
| 1 + | ₩9,136.80 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 772-0085
- 제조사 부품 번호:
- iCE40LP1K-CM49
- 제조업체:
- Lattice Semiconductor
사양
참조 문서
제정법과 컴플라이언스
제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Lattice Semiconductor | |
| Series | iCE40 LP/HX | |
| Product Type | FPGA | |
| Number of Logic Cells | 1280 | |
| Number of Logic Units | 160 | |
| Number of Registers | 1280 | |
| Mount Type | Surface | |
| Package Type | UCBGA | |
| Minimum Supply Voltage | 1.14V | |
| Maximum Supply Voltage | 1.26V | |
| Pin Count | 49 | |
| Number of RAM Bits | 64kB | |
| Number of I/Os | 206 | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 85°C | |
| Width | 3 mm | |
| Height | 0.9mm | |
| Standards/Approvals | Halogen Free | |
| Length | 3mm | |
| Automotive Standard | No | |
| 모두 선택 | ||
|---|---|---|
브랜드 Lattice Semiconductor | ||
Series iCE40 LP/HX | ||
Product Type FPGA | ||
Number of Logic Cells 1280 | ||
Number of Logic Units 160 | ||
Number of Registers 1280 | ||
Mount Type Surface | ||
Package Type UCBGA | ||
Minimum Supply Voltage 1.14V | ||
Maximum Supply Voltage 1.26V | ||
Pin Count 49 | ||
Number of RAM Bits 64kB | ||
Number of I/Os 206 | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 85°C | ||
Width 3 mm | ||
Height 0.9mm | ||
Standards/Approvals Halogen Free | ||
Length 3mm | ||
Automotive Standard No | ||
Field Programmable Gate Arrays, Lattice Semiconductor
An FPGA is a semiconductor device consisting of a Matrix of Configurable Logic Blocks (CLBs) connected through programmable interconnects. The user determines these interconnections by programming SRAM. A CLB can be simple (AND, OR gates, etc) or complex (a Block of RAM). The FPGA allows changes to be MADE to a design even after the device is soldered into a PCB.
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