Infineon NOR 256 MB SPI Flash SPI Multi-I/O 16-Pin SOIC, S25FL256SAGMFIR01

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₩8,960.00

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1 - 4₩8,960.00-
5 - 9₩8,800.001%
10 - 99₩7,980.0010%
100 - 249₩7,860.0012%
250 +₩7,680.0014%

* 참고 가격: 실제 구매가격과 다를 수 있습니다

RS 제품 번호:
273-7505
제조사 부품 번호:
S25FL256SAGMFIR01
제조업체:
Infineon
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브랜드

Infineon

Product Type

Flash SPI Multi-I/O

Memory Size

256MB

Interface Type

SPI

Package Type

SOIC

Pin Count

16

Maximum Clock Frequency

133MHz

Cell Type

NOR

Minimum Supply Voltage

2.7V

Maximum Supply Voltage

3.6V

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

+85°C

Standards/Approvals

RoHS

Series

S25FL

Supply Current

100mA

Automotive Standard

AEC-Q1 Grade 1

Infineon S25FL Series Flash SPI Multi-I/O, 256MB Memory Size, 133MHz Maximum Clock Frequency - S25FL256SAGMFIR01


This flash SPI multi-I/O device provides non-volatile NOR storage for systems requiring persistent code or data retention. Designed for operation across a wide temperature range and compatible with serial peripheral Interface connections, it supports applications where Compact packaged memory and multi-I/O performance are needed. The component is supplied in a 16-pin SOIC package and is RoHS compliant.

Features and Benefits:


• Operates from 2.7V to 3.6V supply enabling flexible power domains
• Supports 133MHz clock for high-speed SPI transfers
• 256MB capacity offering extended non-volatile storage
• 100mA typical supply current suitable for power budgeting
• Rated for -40°C to +85°C for harsh-environment operation

Applications


• Suitable for automotive control modules requiring flash storage
• Ideal for industrial controllers operating at extreme temperatures
• Used with microcontrollers needing SPI boot or code storage
• Can be used for firmware updates in embedded systems
• Used for logging and calibration data in vehicle electronics

What package is provided for board-level mounting?


The device is supplied in a 16-pin SOIC package suited to standard through-board soldering.

Which Interface does it use for communication?


It communicates via an SPI Interface supporting multi-I/O signalling.

What type of memory cell architecture is implemented?


The component uses NOR cell architecture for non-volatile code storage.

Is the device qualified for automotive reliability standards?


It meets AEC-Q1 Grade 1 automotive standard.

What environmental compliance does it hold?


The part is RoHS compliant.

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