Infineon NOR 256 MB SPI FL-S Flash 16-Pin WSON, S25FL256SAGMFI003

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RS 제품 번호:
273-5390
제조사 부품 번호:
S25FL256SAGMFI003
제조업체:
Infineon
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브랜드

Infineon

Product Type

FL-S Flash

Memory Size

256MB

Interface Type

SPI

Package Type

WSON

Pin Count

16

Organisation

32MB

Maximum Clock Frequency

133MHz

Cell Type

NOR

Minimum Supply Voltage

2.7V

Maximum Supply Voltage

3.6V

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

+85°C

Standards/Approvals

RoHS

Series

S25FL

Supply Current

100mA

Automotive Standard

AEC-Q100

COO (Country of Origin):
US

Infineon S25FL Series FL-S Flash, 256MB Memory Size, 2.7V Minimum Supply Voltage - S25FL256SAGMFI003


This fl-s flash is a high-capacity SPI NOR device designed for embedded systems requiring non-volatile storage across extended temperature ranges. It operates from low to elevated ambient conditions and interfaces via SPI to deliver fast read/write access for firmware, boot code and data logging in industrial and automotive contexts. The device is supplied in a Compact WSON package suitable for space-constrained boards and meets environmental restrictions for electronic components.

Features and Benefits:


• 133MHz clock supporting fast serial data transfers
• 2.7V to 3.6V range enabling flexible power-rail integration
• -40°C to +85°C rating permitting operation in harsh environments
• 100mA supply current allowing predictable power budgeting
• 16-pin WSON package minimising PCB footprint

Applications


• Suitable for automotive control unit firmware storage
• Ideal for industrial data-logging devices and gateways
• Used with gateway modules requiring Compact memory
• Can be used for boot code in embedded controllers
• Suitable for instrumentation operating across wide temperatures

What Interface does it use for communication?


It communicates over a serial peripheral Interface capable of high-speed SPI signalling.

Which package type should PCB designers expect for placement?


The component is supplied in a WSON package with a 16-pin footprint for surface-mount assembly.

What semiconductor cell architecture is implemented for non-volatile storage?


It uses NOR-type cells suitable for Execute-In-Place and direct code execution.

Is there an automotive qualification relevant to design-in?


It complies with the AEC-Q100 automotive standard applicable to semiconductor components.

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